5SGXMA4K1F40I2N

The 5SGXMA4K1F40I2N is an Intel Stratix V GX field programmable gate array (FPGA) supplied in a 1517-ball FCBGA package. It delivers high logic density with 420,000 logic elements and approximately 37.9 Mbits of embedded RAM, combined with 600 user I/O pins for complex system integration.

Designed for industrial-grade applications, this surface-mount FPGA operates from a core supply of 870 mV to 930 mV and supports an operating temperature range of −40 °C to 100 °C, making it suitable for demanding embedded and connectivity-focused designs that require substantial on-chip logic and memory capacity.

Key Features

• High Logic Density — 420,000 logic elements to implement large-scale digital logic, algorithms, and custom processors on-chip.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive functions without external memory dependence.
• Extensive I/O — 600 user I/O pins provide flexible interfacing for multi-channel I/O, high-pin-count peripherals, and wide parallel buses.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments and systems.
• Core Voltage Range — Core supply specified from 870 mV to 930 mV for predictable power and timing behavior in system designs.
• Package and Mounting — 1517-ball BGA (FCBGA) package, supplier package 1517-FBGA (40×40), surface-mount for standard PCB assembly processes.
• RoHS Compliant — Conforms to RoHS requirements for reduced hazardous substances in electronic assemblies.

Typical Applications

• High-density digital processing — Implement complex signal processing, custom compute engines, and algorithm acceleration using abundant logic elements and on-chip RAM.
• Multi-channel I/O systems — Support wide parallel interfaces, multi-peripheral aggregation, and protocol bridging with 600 user I/O pins.
• Industrial control and automation — Deploy in industrial systems where the device’s industrial temperature rating and robust package support extended environmental operation.

Unique Advantages

• Substantial on-chip resources: 420,000 logic elements paired with approximately 37.9 Mbits of embedded RAM reduce the need for external logic and memory, simplifying board-level design.
• High I/O bandwidth: 600 user I/Os enable dense peripheral integration and flexible interfacing options for complex systems.
• Industrial-ready thermal range: −40 °C to 100 °C operating range supports deployment in demanding environments without additional thermal qualification.
• Compact, manufacturable package: 1517-ball FCBGA (40×40) surface-mount package balances high pin count with standard PCB assembly workflows.
• Controlled core supply: Defined core voltage of 870 mV to 930 mV helps ensure consistent power and timing across designs.
• RoHS compliance: Facilitates integration into products that must meet environmental substance rules.

Why Choose 5SGXMA4K1F40I2N?

The 5SGXMA4K1F40I2N positions itself as a high-density, industrial-grade FPGA option for designers who need large logic capacity, significant embedded memory, and a high number of I/Os in a single, surface-mount package. Its specified core voltage range and broad operating temperature make it suitable for robust embedded and connectivity applications that demand on-chip integration and reliable operation.

Choose this device when your design requires substantial programmable logic, embedded RAM, and expansive I/O in a package optimized for standard manufacturing processes—while remaining RoHS compliant and rated for industrial temperature operation.

Request a quote or submit an inquiry to obtain pricing, availability, and integration support for the 5SGXMA4K1F40I2N.