5SGXMA4K1F40C2LN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 899 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4K1F40C2LN – Stratix® V GX FPGA, 420,000 logic elements, 600 I/Os
The 5SGXMA4K1F40C2LN is a Stratix® V GX field programmable gate array (FPGA) from Intel (Altera) delivering high logic density and extensive I/O for complex digital designs. This commercial-grade device combines 420,000 logic elements with approximately 37.9 Mbits of embedded memory and up to 600 I/O pins to support large-scale system integration and advanced hardware acceleration.
Designed for surface-mount PCB assembly in a 1517-BBGA (FCBGA) package (supplier package: 1517-FBGA, 40×40), the device operates from 820 mV to 880 mV core supply and across a commercial operating temperature range of 0°C to 85°C. The Stratix V family datasheet documents transceiver speed grades for GX devices, enabling designers to reference series-level transceiver capabilities.
Key Features
- Core Logic — 420,000 logic elements provide the capacity needed for large custom logic functions, complex state machines, and hardware-accelerated algorithms.
- Embedded Memory — Approximately 37.9 Mbits of on-chip RAM to support deep buffering, LUT storage, and local data processing without external memory.
- I/O Density — Up to 600 user I/Os to accommodate wide buses, multi-protocol interfaces, and dense board-level connectivity.
- Package & Mounting — 1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) optimized for surface-mount assembly on high-density PCBs.
- Power Supply — Core supply range from 820 mV to 880 mV to meet defined FPGA core voltage requirements.
- Commercial Temperature Grade — Rated for 0°C to 85°C operation to meet typical commercial system requirements.
- Standards Compliance — RoHS compliant for environmental and manufacturing compatibility.
Typical Applications
- High-density compute modules — Use the device's large logic capacity and embedded memory for custom accelerators and data-path processing.
- Telecom and data infrastructure — High I/O counts and series-documented transceiver capabilities support multi-channel interface consolidation and protocol bridging.
- Advanced imaging and signal processing — Large on-chip RAM and extensive logic enable real-time DSP pipelines and image-processing engines.
Unique Advantages
- Large programmable fabric: 420,000 logic elements reduce the need for multiple FPGAs by integrating complex functions into a single device.
- Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM supports deep buffering and localized data manipulation, minimizing external memory traffic.
- Extensive I/O connectivity: 600 I/Os provide flexibility for wide parallel interfaces and multi-protocol expansion without external multiplexing logic.
- Commercial-grade thermal profile: Rated 0°C to 85°C for reliable operation in mainstream electronics and controlled-environment systems.
- RoHS compliance: Meets environmental manufacturing requirements for lead-free assembly and global distribution.
Why Choose 5SGXMA4K1F40C2LN?
The 5SGXMA4K1F40C2LN positions itself for designs that require a combination of high logic density, sizable embedded memory, and numerous I/Os within a single commercial-grade FPGA package. Its package and surface-mount form factor simplify integration into high-density PCBs while the documented Stratix V GX series characteristics provide design teams with referenceable transceiver performance at the series level.
This part is suitable for engineering teams building complex compute, networking, or DSP systems that need consolidation of functions, reduced board-level component count, and robust on-chip resources. The device’s commercial temperature rating, RoHS compliance, and clear electrical parameters make it a practical choice for production deployments in commercial electronics.
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