5SGXMA4K1F40C2LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 943 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4K1F40C2LG – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXMA4K1F40C2LG is a Stratix® V GX series FPGA from Intel designed for high-density, commercial programmable logic applications. It provides a large logic fabric with integrated on-chip memory and extensive I/O to support complex system designs that require significant gate counts and flexible interfacing.
With 420,000 logic elements, approximately 37.9 Mbits of embedded memory and up to 600 I/Os in a 1517-BBGA FCBGA package, this device targets commercial systems where logic capacity, I/O count and package density are critical design drivers.
Key Features
- Core Logic Density — 420,000 logic elements for implementing large-scale programmable logic and complex custom functions.
- Embedded Memory — Approximately 37.9 Mbits of on-chip RAM to support buffering, state storage and memory-intensive logic functions.
- I/O Capability — Up to 600 I/Os to accommodate wide buses, multiple peripherals and high pin-count interfaces.
- Package and Mounting — 1517-BBGA (FCBGA) package, supplier package listed as 1517-FBGA (40×40), designed for surface-mount assembly.
- Power and Core Supply — Core voltage supply specified at 820 mV to 880 mV.
- Commercial Grade Temperature — Rated for 0 °C to 85 °C operation for commercial applications.
- Standards Compliance — RoHS compliant.
- Family Documentation — Device characteristics and electrical/switching parameters are covered in the Stratix V device datasheet.
Typical Applications
- Programmable Logic in Commercial Systems — Implement control, data-path and custom compute blocks where a high logic count and significant on-chip memory are required.
- High-Density I/O Designs — Support systems that require many external interfaces or wide parallel buses through up to 600 I/Os.
- Prototyping and Development Platforms — Use as a target device for validating large FPGA-based algorithms and system-level integration in commercial temperature environments.
Unique Advantages
- High Logic Capacity: 420,000 logic elements enable integration of large custom functions and complex state machines on a single device, reducing external logic.
- Substantial On-Chip Memory: Approximately 37.9 Mbits of embedded RAM allows local buffering and memory-intensive designs without relying on external memory for many use cases.
- Extensive I/O Array: Up to 600 I/Os support broad connectivity and multiple peripheral interfaces, simplifying board-level routing for high-pin-count systems.
- Compact, Surface-Mount Package: 1517-BBGA (1517-FBGA 40×40) packaging delivers high pin density in a surface-mount form factor for space-constrained boards.
- Commercial Temperature Rating: Rated 0 °C to 85 °C to match commercial deployment requirements and operating environments.
- RoHS Compliant: Meets RoHS requirements for regulated substance use in commercial electronic products.
Why Choose 5SGXMA4K1F40C2LG?
The 5SGXMA4K1F40C2LG positions itself as a high-density Stratix V GX FPGA option for commercial systems that demand large programmable logic capacity, substantial embedded memory and broad I/O. Its combination of 420,000 logic elements, approximately 37.9 Mbits of on-chip RAM and up to 600 I/Os in a compact 1517-BBGA package makes it suitable for designs that consolidate functions and reduce external component count.
Backed by Intel’s Stratix V family documentation, this device is appropriate for engineering teams working on complex FPGA-based solutions in commercial temperature environments who require predictable electrical and switching characteristics and the ability to scale design complexity within a single, high-density FPGA.
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