5SGXMA4K2F35C1N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,426 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4K2F35C1N – Stratix® V GX FPGA, 420,000 Logic Elements
The 5SGXMA4K2F35C1N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel designed for demanding digital designs that require high logic density, substantial on-chip memory, and a large number of I/O signals. Built in a 1152-ball BGA (35 × 35 mm) surface-mount package, this commercial-grade device targets applications that need highly configurable logic, broad interfacing capability, and a compact, high-pin-count form factor.
Key attributes include 420,000 logic elements, approximately 38 Mbits of embedded memory, and 600 I/O pins, providing a balance of compute resources and connectivity for advanced signal processing, networking, and compute-acceleration designs.
Key Features
- Core & Logic Capacity — 420,000 logic elements and 158,500 logic array blocks provide substantial programmable fabric for complex custom logic, DSP blocks, and control functions.
- Embedded Memory — Approximately 38 Mbits of on-chip RAM for buffering, large lookup tables, and state storage within the FPGA fabric.
- I/O Density — 600 user I/O pins to support wide parallel interfaces, high-pin-count peripherals, and flexible board-level connectivity.
- Power Supply — Core voltage supply range of 870 mV to 930 mV, enabling predictable core power planning and board power design.
- Temperature & Grade — Commercial temperature grade with operating range from 0 °C to 85 °C for standard commercial applications.
- Package & Mounting — 1152-BBGA, FCBGA (supplier package: 1152-FBGA 35×35) in a surface-mount format for compact, high-density PCB layouts.
- Environmental Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.
Typical Applications
- High‑Performance Networking — Use the large logic fabric and high I/O count to implement packet processing, switching, and custom network protocol engines.
- Signal Processing & DSP — Implement complex digital filters, data aggregation, and real‑time processing algorithms that benefit from abundant logic and embedded RAM.
- Compute Acceleration — Offload compute‑intensive kernels to FPGA logic for specialized acceleration in server or appliance-class designs.
- Test & Measurement — Drive multi-channel sampling, deterministic timing control, and custom data handling using the device's I/O capacity and memory resources.
Unique Advantages
- High Logic Density: 420,000 logic elements enable large custom designs and complex system-on-chip implementations without immediate escalation to multiple devices.
- Substantial On-Chip Memory: Approximately 38 Mbits of embedded RAM reduces external memory dependencies and simplifies data buffering and latency-sensitive tasks.
- Extensive I/O Capability: 600 I/Os provide flexibility to connect multiple peripherals, wide buses, or parallel ADC/DAC channels directly to the FPGA.
- Compact High-Pin-Count Package: The 1152-ball FCBGA (35×35) package delivers a dense pinout in a compact footprint suitable for space-constrained designs.
- Predictable Power Envelope: Defined core supply range of 870 mV–930 mV allows designers to plan power delivery and thermal considerations accurately.
- Commercial Temperature Rating: Operates across a standard commercial range (0 °C–85 °C) for mainstream embedded and enterprise applications.
- RoHS Compliant: Meets lead‑free assembly requirements for modern electronics manufacturing.
Why Choose 5SGXMA4K2F35C1N?
The 5SGXMA4K2F35C1N positions itself as a high-density, highly configurable FPGA solution for teams building advanced digital systems that require a combination of large logic capacity, significant on-chip memory, and broad I/O connectivity. Its 1152-ball BGA package and surface-mount assembly make it suitable for dense PCB layouts while the commercial temperature rating fits many enterprise and embedded product deployments.
Engineers and procurement teams looking for a Stratix V GX device from Intel with verifiable specifications—logic elements, embedded RAM, I/O count, package details, supply voltage, and operating temperature—will find this part appropriate for prototypes through production designs that match these defined parameters.
Request a quote or submit an inquiry for pricing and availability to move forward with sourcing and design planning.

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