5SGXMA4K2F35C1N

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 1,426 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4K2F35C1N – Stratix® V GX FPGA, 420,000 Logic Elements

The 5SGXMA4K2F35C1N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel designed for demanding digital designs that require high logic density, substantial on-chip memory, and a large number of I/O signals. Built in a 1152-ball BGA (35 × 35 mm) surface-mount package, this commercial-grade device targets applications that need highly configurable logic, broad interfacing capability, and a compact, high-pin-count form factor.

Key attributes include 420,000 logic elements, approximately 38 Mbits of embedded memory, and 600 I/O pins, providing a balance of compute resources and connectivity for advanced signal processing, networking, and compute-acceleration designs.

Key Features

  • Core & Logic Capacity — 420,000 logic elements and 158,500 logic array blocks provide substantial programmable fabric for complex custom logic, DSP blocks, and control functions.
  • Embedded Memory — Approximately 38 Mbits of on-chip RAM for buffering, large lookup tables, and state storage within the FPGA fabric.
  • I/O Density — 600 user I/O pins to support wide parallel interfaces, high-pin-count peripherals, and flexible board-level connectivity.
  • Power Supply — Core voltage supply range of 870 mV to 930 mV, enabling predictable core power planning and board power design.
  • Temperature & Grade — Commercial temperature grade with operating range from 0 °C to 85 °C for standard commercial applications.
  • Package & Mounting — 1152-BBGA, FCBGA (supplier package: 1152-FBGA 35×35) in a surface-mount format for compact, high-density PCB layouts.
  • Environmental Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

  • High‑Performance Networking — Use the large logic fabric and high I/O count to implement packet processing, switching, and custom network protocol engines.
  • Signal Processing & DSP — Implement complex digital filters, data aggregation, and real‑time processing algorithms that benefit from abundant logic and embedded RAM.
  • Compute Acceleration — Offload compute‑intensive kernels to FPGA logic for specialized acceleration in server or appliance-class designs.
  • Test & Measurement — Drive multi-channel sampling, deterministic timing control, and custom data handling using the device's I/O capacity and memory resources.

Unique Advantages

  • High Logic Density: 420,000 logic elements enable large custom designs and complex system-on-chip implementations without immediate escalation to multiple devices.
  • Substantial On-Chip Memory: Approximately 38 Mbits of embedded RAM reduces external memory dependencies and simplifies data buffering and latency-sensitive tasks.
  • Extensive I/O Capability: 600 I/Os provide flexibility to connect multiple peripherals, wide buses, or parallel ADC/DAC channels directly to the FPGA.
  • Compact High-Pin-Count Package: The 1152-ball FCBGA (35×35) package delivers a dense pinout in a compact footprint suitable for space-constrained designs.
  • Predictable Power Envelope: Defined core supply range of 870 mV–930 mV allows designers to plan power delivery and thermal considerations accurately.
  • Commercial Temperature Rating: Operates across a standard commercial range (0 °C–85 °C) for mainstream embedded and enterprise applications.
  • RoHS Compliant: Meets lead‑free assembly requirements for modern electronics manufacturing.

Why Choose 5SGXMA4K2F35C1N?

The 5SGXMA4K2F35C1N positions itself as a high-density, highly configurable FPGA solution for teams building advanced digital systems that require a combination of large logic capacity, significant on-chip memory, and broad I/O connectivity. Its 1152-ball BGA package and surface-mount assembly make it suitable for dense PCB layouts while the commercial temperature rating fits many enterprise and embedded product deployments.

Engineers and procurement teams looking for a Stratix V GX device from Intel with verifiable specifications—logic elements, embedded RAM, I/O count, package details, supply voltage, and operating temperature—will find this part appropriate for prototypes through production designs that match these defined parameters.

Request a quote or submit an inquiry for pricing and availability to move forward with sourcing and design planning.

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