5SGXMA4K2F35C2LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 675 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4K2F35C2LG – Stratix® V GX Field Programmable Gate Array, 1152-BBGA
The 5SGXMA4K2F35C2LG is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel provided in a 1152-BBGA FCBGA package. It delivers high logic density, on-chip RAM, and extensive I/O to support complex, configurable digital designs in commercial-temperature applications.
With 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and 600 I/O pins, this device is suited for high-density digital processing, communications interfaces, and custom hardware acceleration where integration and scalability are required.
Key Features
- Core Logic 420,000 logic elements provide capacity for large, complex FPGA designs and custom logic implementations.
- Embedded Memory Approximately 37.9 Mbits (37,888,000 bits) of on-chip RAM for buffering, FIFOs, and local data storage.
- I/O Count 600 I/O pins to accommodate wide parallel interfaces, multiple peripherals, and high-pin-count system connectivity.
- Power and Core Supply Core supply voltage range of 820 mV to 880 mV to support the device’s operating requirements and power architecture.
- Package and Mounting 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), designed for surface-mount PCB assembly.
- Temperature Grade Commercial operating temperature range of 0 °C to 85 °C, suitable for standard commercial electronic environments.
- Standards Compliance RoHS compliant, meeting common environmental and materials requirements for electronic components.
Typical Applications
- High-density digital processing Implement complex state machines, custom datapaths, and parallel processing blocks using the large logic resource pool.
- Communications and networking Leverage the device’s extensive I/O and on-chip memory for packet buffering, protocol handling, and interface bridging.
- Hardware acceleration and prototyping Deploy custom accelerators and prototype system-on-chip functions that require significant logic and embedded RAM.
- Sensor aggregation and control Aggregate multiple sensor inputs and implement deterministic control or preprocessing with plentiful I/O and local memory.
Unique Advantages
- High logic capacity: 420,000 logic elements enable integration of large, multi-functional designs into a single device, reducing system-level component count.
- Substantial on-chip RAM: Approximately 37.9 Mbits of embedded memory supports deep buffering and local data processing without external memory dependence.
- Extensive I/O resources: 600 I/O pins provide flexibility for wide buses, multiple interfaces, and mixed-signal front-end connections.
- Compact, board-ready package: The 1152-BBGA FCBGA package and surface-mount mounting simplify PCB layout for high-density board designs.
- Commercial temperature support: Rated for 0 °C to 85 °C operation, suitable for standard commercial electronics and controlled-environment deployments.
- Regulatory compliance: RoHS compliance helps meet environmental and materials requirements for many commercial products.
Why Choose 5SGXMA4K2F35C2LG?
The 5SGXMA4K2F35C2LG positions itself as a high-capacity Stratix V GX FPGA for commercial applications that demand large logic resources, substantial embedded memory, and broad I/O connectivity in a compact FCBGA package. Its combination of 420,000 logic elements, roughly 37.9 Mbits of on-chip RAM, and 600 I/O pins supports complex digital systems, communications interfaces, and hardware-accelerated functions while maintaining commercial-temperature operation.
This device is appropriate for engineering teams building scalable, high-density FPGA solutions who require the integration benefits and configurable flexibility provided by the Stratix V GX family.
Request a quote or submit an inquiry for the 5SGXMA4K2F35C2LG to receive pricing and availability information tailored to your project needs.

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