5SGXMA4K2F35C2LG

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 675 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4K2F35C2LG – Stratix® V GX Field Programmable Gate Array, 1152-BBGA

The 5SGXMA4K2F35C2LG is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel provided in a 1152-BBGA FCBGA package. It delivers high logic density, on-chip RAM, and extensive I/O to support complex, configurable digital designs in commercial-temperature applications.

With 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and 600 I/O pins, this device is suited for high-density digital processing, communications interfaces, and custom hardware acceleration where integration and scalability are required.

Key Features

  • Core Logic  420,000 logic elements provide capacity for large, complex FPGA designs and custom logic implementations.
  • Embedded Memory  Approximately 37.9 Mbits (37,888,000 bits) of on-chip RAM for buffering, FIFOs, and local data storage.
  • I/O Count  600 I/O pins to accommodate wide parallel interfaces, multiple peripherals, and high-pin-count system connectivity.
  • Power and Core Supply  Core supply voltage range of 820 mV to 880 mV to support the device’s operating requirements and power architecture.
  • Package and Mounting  1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), designed for surface-mount PCB assembly.
  • Temperature Grade  Commercial operating temperature range of 0 °C to 85 °C, suitable for standard commercial electronic environments.
  • Standards Compliance  RoHS compliant, meeting common environmental and materials requirements for electronic components.

Typical Applications

  • High-density digital processing  Implement complex state machines, custom datapaths, and parallel processing blocks using the large logic resource pool.
  • Communications and networking  Leverage the device’s extensive I/O and on-chip memory for packet buffering, protocol handling, and interface bridging.
  • Hardware acceleration and prototyping  Deploy custom accelerators and prototype system-on-chip functions that require significant logic and embedded RAM.
  • Sensor aggregation and control  Aggregate multiple sensor inputs and implement deterministic control or preprocessing with plentiful I/O and local memory.

Unique Advantages

  • High logic capacity: 420,000 logic elements enable integration of large, multi-functional designs into a single device, reducing system-level component count.
  • Substantial on-chip RAM: Approximately 37.9 Mbits of embedded memory supports deep buffering and local data processing without external memory dependence.
  • Extensive I/O resources: 600 I/O pins provide flexibility for wide buses, multiple interfaces, and mixed-signal front-end connections.
  • Compact, board-ready package: The 1152-BBGA FCBGA package and surface-mount mounting simplify PCB layout for high-density board designs.
  • Commercial temperature support: Rated for 0 °C to 85 °C operation, suitable for standard commercial electronics and controlled-environment deployments.
  • Regulatory compliance: RoHS compliance helps meet environmental and materials requirements for many commercial products.

Why Choose 5SGXMA4K2F35C2LG?

The 5SGXMA4K2F35C2LG positions itself as a high-capacity Stratix V GX FPGA for commercial applications that demand large logic resources, substantial embedded memory, and broad I/O connectivity in a compact FCBGA package. Its combination of 420,000 logic elements, roughly 37.9 Mbits of on-chip RAM, and 600 I/O pins supports complex digital systems, communications interfaces, and hardware-accelerated functions while maintaining commercial-temperature operation.

This device is appropriate for engineering teams building scalable, high-density FPGA solutions who require the integration benefits and configurable flexibility provided by the Stratix V GX family.

Request a quote or submit an inquiry for the 5SGXMA4K2F35C2LG to receive pricing and availability information tailored to your project needs.

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