5SGXMA4K2F35C2WN

The 5SGXMA4K2F35C2WN is a Stratix® V GX field programmable gate array (FPGA) in a 1152‑FBGA surface‑mount package. It delivers very high logic capacity and substantial on‑chip memory for dense digital designs requiring large logic and RAM resources while operating within commercial temperature ranges.

As a member of the Stratix V GX family, this device is targeted at designs that need high integration density, abundant I/O, and tightly specified core voltage and operating conditions.

Key Features

• Logic Capacity  420,000 logic elements provide significant programmable fabric for complex digital functions and custom accelerators.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM (37,888,000 bits) supports large buffering, LUTs, and state storage without external memory.
• I/O Resources  600 I/O pins support extensive peripheral interfacing and board-level connectivity for high‑density designs.
• Power and Core Supply  Core voltage range specified at 870 mV to 930 mV to meet defined operating conditions for the device.
• Package and Mounting  1152‑FBGA (35×35) supplier package; package case listed as 1152‑BBGA, FCBGA; surface‑mount mounting type for compact board integration.
• Temperature Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Manufacturer and Family  Intel Stratix V GX family device—electrical and switching characteristics follow the Stratix V device datasheet guidance.
• RoHS Compliant  Device is RoHS compliant for environmental and regulatory considerations.

Typical Applications

• High‑density digital processing  Large logic element count and extensive on‑chip RAM make the FPGA suitable for heavy compute and custom datapath implementations.
• Prototyping and system validation  High logic and I/O counts enable complex system emulation and hardware prototyping on a single device.
• Interface aggregation  600 I/O pins allow aggregation and bridging of multiple interfaces within space‑constrained systems.

Unique Advantages

• High programmable capacity: 420,000 logic elements reduce the need for multi‑device partitioning on large designs.
• Large on‑chip memory: Approximately 37.9 Mbits of embedded RAM supports frame buffers, FIFOs, and state machines without immediate dependence on external memory.
• Extensive I/O availability: 600 I/Os offer flexible board‑level connectivity and peripheral support for complex systems.
• Compact, production‑ready package: 1152‑FBGA (35×35) surface‑mount packaging enables densely routed PCB layouts for volume manufacturing.
• Defined operating envelope: Commercial grade operation from 0 °C to 85 °C and a specific core voltage window (870 mV–930 mV) support predictable electrical integration.
• Vendor‑backed family: Part of the Stratix V GX family from Intel, providing alignment with documented electrical and switching characteristics.

Why Choose 5SGXMA4K2F35C2WN?

The 5SGXMA4K2F35C2WN positions itself where high logic density, substantial embedded RAM, and broad I/O capacity are required in a single commercial‑grade FPGA package. Its specification set—420,000 logic elements, approximately 37.9 Mbits of on‑chip memory, 600 I/Os, and a compact 1152‑FBGA footprint—helps simplify system architecture by consolidating functions that might otherwise need multiple devices.

This device is suitable for engineering teams developing complex digital systems, board‑level prototypes, and production products that fit within commercial temperature ranges and require a well‑defined core voltage and package form factor. Selection of this Stratix V GX FPGA leverages Intel’s Stratix V family documentation and device characterization for design and integration planning.

Request a quote or submit a procurement inquiry to receive pricing and availability for 5SGXMA4K2F35C2WN.