5SGXMA4K2F35C3WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,578 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4K2F35C3WN – Stratix® V GX Field Programmable Gate Array (FPGA)
The 5SGXMA4K2F35C3WN is a Stratix V GX FPGA in a 1152-BBGA (35×35) FCBGA package, optimized for designs that require large programmable logic capacity and extensive I/O. This commercial-grade device delivers 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and up to 600 I/O pins for dense, high-bandwidth system implementations.
As part of the Stratix V GX family, the device supports the series’ transceiver options and core-focused performance characteristics, making it suitable for high-performance communications, compute acceleration, and complex system integration projects that need scalable programmable logic and abundant on-chip memory.
Key Features
- Core Logic 420,000 logic elements provide substantial programmable resources for complex digital designs and algorithm implementation.
- Embedded Memory Approximately 37.9 Mbits of on-chip RAM to support buffering, state storage, and data-intensive processing close to the logic fabric.
- I/O Density & Package Up to 600 I/O pins in a 1152-FBGA (35×35) surface-mount package for high-pin-count system connectivity and dense board integration.
- Power/Voltage Core supply rated between 820 mV and 880 mV, enabling clear power budgeting for core domains.
- Commercial Grade Temperature Range Rated for 0°C to 85°C operation, suitable for standard commercial electronics environments.
- Series Transceiver Capability Part of the Stratix V GX family, which includes transceiver speed grades detailed in the Stratix V device documentation for high-speed serial interfaces.
- Mounting & Compliance Surface-mount FCBGA package and RoHS-compliant manufacturing to meet common assembly and environmental requirements.
Typical Applications
- High-speed Communications Leverage the Stratix V GX family transceiver capabilities and the device’s high I/O count for multi-gigabit networking, backplane, and switch/router designs.
- Data Processing & Acceleration Large logic capacity and significant on-chip RAM make this FPGA suitable for algorithm acceleration, packet processing, and inline data transformation tasks.
- Prototype & System Integration Use the device for hardware prototyping and complex SoC integration where a high number of I/Os and programmable resources are required.
- Signal Processing Embedded memory and extensive logic allow implementation of real-time DSP, video processing pipelines, and sensor data aggregation within a single programmable device.
Unique Advantages
- Substantial Logic Capacity: 420,000 logic elements enable implementation of large, feature-rich designs without immediate partitioning across multiple devices.
- Large On-chip RAM: Approximately 37.9 Mbits of embedded memory reduces external memory dependencies and improves data locality for latency-sensitive functions.
- High I/O Count in a Compact Package: 600 I/Os in a 1152-FBGA (35×35) FCBGA package provides a balance of connectivity and board-area efficiency for dense system designs.
- Commercial Temperature Suitability: Rated 0°C to 85°C for reliable operation within standard commercial environments.
- Clear Power Envelope: Defined core supply range (820–880 mV) supports precise power planning and domain partitioning in multi-voltage systems.
- RoHS Compliant: Built to meet environmental directives for lead-free assembly and materials.
Why Choose 5SGXMA4K2F35C3WN?
The 5SGXMA4K2F35C3WN positions itself as a high-capacity Stratix V GX FPGA for projects that demand large programmable logic, generous embedded memory, and extensive I/O in a single commercial-grade package. Its combination of 420,000 logic elements, approximately 37.9 Mbits of on-chip RAM, and up to 600 I/Os helps reduce system complexity and supports consolidation of functions that would otherwise require multiple devices.
This device is well suited to engineering teams building high-performance communications, data processing, and advanced prototyping platforms that rely on a robust FPGA fabric, significant local memory, and a high-density package supported by Stratix V family documentation and implementation guidance.
Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGXMA4K2F35C3WN for your next high-capacity FPGA design.

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