5SGXMA4K2F35C3G

The 5SGXMA4K2F35C3G is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, offered in a commercial temperature grade. It provides a high-density programmable fabric with 420,000 logic elements and approximately 37.9 Mbits of on-chip RAM, designed for commercial applications that require large logic capacity, significant embedded memory, and a high I/O count.

Key Features

• Core capacity  420,000 logic elements for implementing complex, high-density designs.
• Embedded memory  Approximately 37.9 Mbits of on-chip RAM (37,888,000 bits) to support data buffering, FIFOs, and memory-intensive functions.
• I/O density  600 user I/Os to accommodate multi-channel interfaces and high-pin-count system integration.
• Power supply  Core voltage range 0.820 V to 0.880 V as specified for device operation.
• Package and mounting  Supplied in a 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount package suitable for standard PCB assembly.
• Operating conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density logic implementations  Deploy where large logic element counts are required to realize complex custom logic and state machines.
• I/O-intensive systems  Ideal for designs that demand a high number of external interfaces or parallel channels, leveraging the 600 I/Os.
• Memory-dense architectures  Use when substantial on-chip RAM (approximately 37.9 Mbits) is needed for buffering, packet processing, or temporary data storage.

Unique Advantages

• Substantial logic capacity:  420,000 logic elements enable implementation of large-scale digital designs without immediate need for external logic expansion.
• Large embedded memory:  Approximately 37.9 Mbits on-chip reduces dependence on external memory for many common buffering and processing tasks.
• High I/O count:  600 I/Os simplify system integration for multi-channel or multi-interface applications, reducing routing complexity.
• Commercial-grade thermal profile:  Rated for 0 °C to 85 °C operation to match typical commercial deployments and environments.
• Compact, surface-mount package:  1152-BBGA (1152-FBGA, 35×35) packaging supports dense PCB layouts and modern assembly processes.
• Standards-aligned compliance:  RoHS compliance supports regulatory requirements for many commercial products and markets.

Why Choose 5SGXMA4K2F35C3G?

The 5SGXMA4K2F35C3G combines a high logic element count, substantial on-chip RAM, and a large I/O complement in a single commercial-grade Stratix V GX device from Intel. It is positioned for commercial designs that demand high integration, significant local memory, and extensive external connectivity while adhering to standard surface-mount packaging and RoHS requirements.

Documentation and electrical characteristics for the Stratix V family are provided in Intel’s device datasheet, enabling system designers to evaluate operating conditions, power, and I/O timing for integration and long-term deployment planning.

If you would like pricing, availability, or to request a quote for 5SGXMA4K2F35C3G, submit a quote request or contact sales through your preferred procurement channel to get started.