5SGXMA4K2F35C2N

The 5SGXMA4K2F35C2N is a Stratix® V GX field programmable gate array (FPGA) in a 1152-BBGA (FCBGA) package. It provides large programmable logic capacity, substantial on-chip memory, and a high I/O count for complex, I/O‑dense designs.

Designed for commercial-temperature applications, this surface-mount device combines up to 420,000 logic elements with approximately 37.9 Mbits of embedded memory and 600 I/Os, enabling integration of high‑capacity digital functions in a single device.

Key Features

• Core Logic  Up to 420,000 logic elements (cells) to implement large-scale digital logic, control and signal-processing functions.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM for buffering, state storage and high-speed data handling.
• I/O Density  600 user I/Os to support wide parallel interfaces, high pin-count interconnects and complex system front-ends.
• Package & Mounting  1152-BBGA (FCBGA) / 1152-FBGA (35×35) package in a surface‑mount form factor for board-level integration.
• Power Supply  Rated core/operating voltage supply range: 870 mV to 930 mV to match system power-rail design requirements.
• Commercial Temperature Grade  Specified for operation from 0 °C to 85 °C for typical commercial-environment deployments.
• Regulatory  RoHS compliant.
• Series Transceiver Options (Series Datasheet)  The Stratix V GX family datasheet documents GX transceiver speed grades (series-level information) for reference when planning high-speed serial interfaces.

Typical Applications

• High-density digital systems  Use the large logic capacity and on-chip memory to consolidate complex digital functions and reduce board-level component count.
• I/O‑intensive designs  Leverage 600 I/Os to interface multiple parallel buses, sensors, front‑end modules or daughtercards.
• Prototyping and platform development  Employ the Stratix V GX device for system validation and development where high logic capacity and plentiful memory are required.

Unique Advantages

• High programmable density: 420,000 logic elements enable implementation of large, integrated digital subsystems without external glue logic.
• Substantial embedded memory: Approximately 37.9 Mbits of RAM simplifies buffering, packet handling and data-path implementations on-chip.
• Extensive I/O capability: 600 I/Os provide flexibility to connect many external devices and wide parallel interfaces directly to the FPGA.
• Board-level-friendly package: 1152-BBGA (35×35 FCBGA) surface-mount package supports compact, high-density PCB layouts.
• Commercial-temperature rating: Specified for 0 °C to 85 °C operation to match typical commercial application environments.
• Standards-compliant supply range: 870 mV to 930 mV supply specification supports controlled power design and verification.

Why Choose 5SGXMA4K2F35C2N?

The 5SGXMA4K2F35C2N positions itself as a high-capacity, commercial-temperature Stratix V GX FPGA suitable for designs that require extensive logic resources, on-chip memory, and a large number of I/Os. Its package and surface-mount format make it appropriate for compact, high-density PCB designs where integration and consolidation of functions reduce BOM and system complexity.

Backed by the Stratix V series datasheet-level information and RoHS compliance, this device suits engineering teams and procurement focused on scalable FPGA platforms with clear electrical and thermal operating parameters. It provides a verifiable specification set for integration into complex digital systems.

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