5SGXMA4K2F35C2G

The 5SGXMA4K2F35C2G is a Stratix® V GX field-programmable gate array (FPGA) from Intel, offered in a commercial temperature grade. It delivers a high density of programmable logic and embedded memory, paired with a large I/O capability and a compact 1152-ball FCBGA package.

This device is suited for designs that require substantial on-chip logic and memory resources along with high I/O counts, while operating within a commercial temperature range and a core supply voltage range of 870 mV to 930 mV.

Key Features

• High-density logic — 420,000 logic elements for complex, highly-parallel programmable logic implementations.
• Embedded memory — approximately 38 Mbits of on-chip RAM to support large buffers, FIFOs, and data-path storage without external memory.
• Extensive I/O — 600 user I/O pins to accommodate wide buses, multiple interfaces, and dense system integration.
• Power supply — Core voltage supply range from 870 mV to 930 mV to match platform power delivery requirements.
• Commercial temperature grade — specified operating range of 0 °C to 85 °C for applications in commercial environments.
• Package and mounting — 1152-ball BGA (FCBGA) surface-mount package, supplier package 1152-FBGA (35×35) for board-level integration.
• RoHS compliant — conforms to RoHS environmental requirements for lead-free manufacturing.

Typical Applications

• High-density digital signal processing — leverage the 420,000 logic elements and approximately 38 Mbits of embedded memory to implement DSP pipelines, filters, and custom arithmetic units.
• Interface aggregation and protocol bridging — use the 600 I/Os to connect and translate between multiple high-pin-count interfaces on a single device.
• Custom compute and acceleration — implement application-specific accelerators where abundant logic and on-chip RAM reduce external memory dependency and system latency.

Unique Advantages

• Substantial on-chip resources: 420,000 logic elements and approximately 38 Mbits of RAM enable integration of large, complex functions on a single device, reducing BOM and board complexity.
• High I/O capacity: 600 I/Os provide flexibility to support wide data paths, parallel interfaces, and mixed-signal front-end connectivity.
• Compact system footprint: 1152-ball FCBGA packaging delivers high pin count in a space-efficient surface-mount form factor suitable for dense boards.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match commercial-grade system requirements.
• Controlled core supply: Narrow core voltage window (870 mV–930 mV) supports predictable power delivery and design planning.
• RoHS compliance: Facilitates designs targeting lead-free manufacturing and environmental compliance.

Why Choose 5SGXMA4K2F35C2G?

The 5SGXMA4K2F35C2G positions itself as a high-density, commercially graded Stratix V GX FPGA option for projects that demand large programmable logic capacity, significant embedded memory, and a high number of I/Os in a compact FCBGA package. Its specified operating voltage and temperature range make it a predictable building block for commercial systems where integration and on-chip resource density are priorities.

This device is appropriate for engineering teams implementing complex digital systems, custom accelerators, or multi-interface hubs that benefit from consolidating logic and memory on a single FPGA, while maintaining RoHS compliance and standard commercial-grade specifications.

Request a quote or submit a pricing inquiry to learn availability, lead times, and volume pricing for the 5SGXMA4K2F35C2G.