5SGXMA4K2F35I2N

The 5SGXMA4K2F35I2N is a Stratix V GX family FPGA in a 1152-BBGA (35×35) FCBGA package designed for industrial-grade embedded designs. It integrates high logic capacity, substantial on-chip memory, and a large I/O count to support complex system-level implementations.

Built for applications requiring dense programmable logic and broad interfacing, this device combines 420,000 logic elements with approximately 37.888 Mbits of embedded memory, 600 I/Os, and an industrial operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  420,000 logic elements (cells) provide extensive programmable fabric for complex logic, state machines, and custom datapaths.
• Embedded Memory  Approximately 37.888 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive accelerators.
• I/O Density  600 I/O pins to accommodate wide parallel interfaces, multi-channel connectivity, and system integration.
• Package  1152-BBGA, FCBGA (supplier package: 1152-FBGA, 35×35) surface-mount package for robust board-level integration.
• Power  Core voltage supply range of 870 mV to 930 mV for compatibility with specified power delivery designs.
• Temperature and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployments requiring extended thermal tolerance.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• High-density logic systems  Designs that require substantial programmable logic capacity and on-chip memory for complex algorithms and state machines.
• Multi-interface controllers  Systems needing extensive I/O for bridging, protocol aggregation, or large parallel data paths.
• Industrial embedded platforms  Applications that demand industrial temperature operation and robust package options for long-term deployments.

Unique Advantages

• Large programmable capacity: 420,000 logic elements enable implementation of complex functionality without external ASICs or large arrays of discrete logic.
• Significant on-chip memory: Approximately 37.888 Mbits of embedded RAM reduces reliance on external memory for buffering and data processing.
• High I/O count: 600 I/Os simplify integration with multiple peripherals, sensors, and high-bandwidth interfaces.
• Industrial-grade operation: −40 °C to 100 °C rating supports reliable operation across a wide thermal envelope.
• Compact, surface-mount package: 1152-BBGA (35×35) FCBGA package balances density and board-level manufacturability for space-constrained designs.
• Controlled core voltage window: 870 mV–930 mV supply range enables predictable power planning and regulator selection.

Why Choose 5SGXMA4K2F35I2N?

The 5SGXMA4K2F35I2N positions itself as a high-capacity Stratix V GX FPGA option for engineers who need dense programmable logic, substantial embedded memory, and extensive I/O in an industrial-grade package. Its combination of 420,000 logic elements, approximately 37.888 Mbits of RAM, and 600 I/Os makes it suitable for system-level integration where on-chip resources and thermal robustness matter.

Choosing this device provides a scalable platform for prototyping and production designs that require sustained performance across a wide temperature range and a compact, board-friendly FCBGA package. RoHS compliance and clear power and thermal specifications simplify qualification and deployment planning.

Request a quote or submit a purchase inquiry for part number 5SGXMA4K2F35I2N to get pricing and availability details for your design needs.