5SGXMA4K2F35I3LN

The 5SGXMA4K2F35I3LN is a Stratix® V GX FPGA optimized for high-density, high-I/O industrial applications. It provides a large programmable fabric with a high logic element count and substantial on-chip RAM to support complex digital processing, protocol handling, and system integration tasks.

Built for surface-mount deployment in a 1152-BBGA / 1152-FBGA (35×35) package and rated for industrial temperature operation, this device targets advanced embedded systems, communications equipment, and industrial controls that require robust performance and extensive I/O connectivity.

Key Features

• Logic Capacity — 420,000 logic elements to implement large-scale digital designs and complex custom algorithms.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM for buffering, packet processing, and data-intensive functions.
• I/O Density — 600 user I/O pins to support wide parallel interfaces, multi‑lane connectivity, and diverse peripheral integration.
• Power and Core Voltage — Core voltage supply specified from 820 mV to 880 mV for the programmable fabric.
• Package and Mounting — 1152-BBGA, FCBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor suitable for compact board layouts.
• Industrial Temperature Rating — Operating temperature range from −40°C to 100°C for reliable operation in industrial environments.
• RoHS Compliant — Conforms to RoHS requirements for restricted substances.

Typical Applications

• High‑performance Communications — Use the device's large logic capacity and high I/O count for protocol processing, packet switching, and interface bridging.
• Signal Processing and Accelerators — Implement complex DSP chains and hardware accelerators using the abundant logic resources and embedded RAM.
• Industrial Control Systems — Deploy in factory automation and motor-control controllers that require industrial temperature operation and extensive I/O.
• Advanced Embedded Systems — Integrate multiple functions (data handling, control, and custom logic) on a single programmable device to reduce system complexity.

Unique Advantages

• High integration density: 420,000 logic elements and substantial on‑chip RAM reduce the need for external logic and memory components.
• Extensive I/O connectivity: 600 I/Os enable complex board-level interfacing and support for multiple parallel and serial peripherals.
• Industrial robustness: Rated from −40°C to 100°C, supporting deployments in demanding temperature environments.
• Compact package: 1152‑FBGA (35×35) surface‑mount package allows dense PCB layouts while maintaining high pin count.
• Controlled core voltage: Specified 820–880 mV supply range enables predictable power planning for system designers.
• Standards-aligned manufacturing: RoHS compliance supports regulatory and environmental requirements.

Why Choose 5SGXMA4K2F35I3LN?

The 5SGXMA4K2F35I3LN delivers a combination of high logic capacity, significant on‑chip memory, and a large I/O complement in a compact, industrial‑rated package. This makes it well suited for designs that demand integration of complex digital functions, high-throughput data handling, and robust operation across a wide temperature range.

Engineers and procurement teams seeking a scalable, high-density FPGA solution will find this Stratix® V GX device appropriate for advanced communications, signal processing, and industrial embedded applications where performance, I/O count, and thermal robustness are key selection criteria.

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