5SGXMA4K2F35I2WN

The 5SGXMA4K2F35I2WN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC that provides high-density programmable logic and substantial on-chip memory for demanding embedded designs. This industrial-grade device integrates 420,000 logic elements and approximately 37.9 Mbits of embedded memory with up to 600 user I/Os in a compact FCBGA package.

With a specified core supply range of 870 mV to 930 mV and an operating temperature range of –40 °C to 100 °C, the device is optimized for robust, high-density applications that require extended temperature operation and high I/O count in a surface-mount form factor.

Key Features

• Core Logic  420,000 logic elements provide a large programmable fabric for complex logic, finite-state machines, and custom datapaths.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM for buffering, lookup tables, and tight-coupled data storage.
• I/O Density  Up to 600 user I/Os to support extensive parallel interfaces and high-pin-count system connectivity.
• Package & Mounting  1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), designed for surface-mount assembly to enable dense PCB layouts.
• Power  Core supply specified from 870 mV to 930 mV to match system power-rail design needs.
• Temperature & Grade  Industrial-grade device rated for operation from –40 °C to 100 °C for extended temperature environments.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic systems  Implement large custom logic blocks and complex control engines using the device’s 420,000 logic elements and extensive on-chip RAM.
• High I/O interface hubs  Use the 600 I/Os to concentrate and bridge multiple parallel and serial interfaces on a single FPGA fabric.
• Industrial embedded platforms  Leverage the industrial operating temperature range for robust operation in factory automation, instrumentation, and industrial control applications.

Unique Advantages

• High integration density: Consolidate complex logic and multiple functions into a single device thanks to 420,000 logic elements and substantial embedded RAM, reducing external component count.
• Large on-chip memory: Approximately 37.9 Mbits of RAM enable local buffering and table storage, minimizing external memory bandwidth requirements.
• Extensive I/O capacity: 600 I/Os allow direct connection to many peripherals and subsystems without intermediary multiplexing hardware.
• Industrial temperature rating: Rated for –40 °C to 100 °C operation to support deployments in temperature-challenging environments.
• Compact FCBGA package: 1152-ball FCBGA (35×35) enables a dense PCB footprint while supporting a high pin count for system integration.
• Regulatory compliance: RoHS compliance supports environmentally conscious assembly and regulatory requirements.

Why Choose 5SGXMA4K2F35I2WN?

The 5SGXMA4K2F35I2WN positions itself for designs that demand high logic capacity, significant embedded memory, and large I/O counts in an industrial-temperature FPGA. Its combination of 420,000 logic elements, approximately 37.9 Mbits of on-chip RAM, and 600 I/Os in a 1152-ball FCBGA package makes it suitable for consolidating complex functionality and reducing system BOM in dense embedded systems.

This device is well suited to engineers and procurement teams building industrial and high-density programmable logic solutions that require robust thermal range, compact packaging, and verifiable electrical requirements such as the specified core voltage range of 870 mV to 930 mV.

Request a quote or submit a product inquiry to obtain pricing, availability, and additional technical information for the 5SGXMA4K2F35I2WN.