5SGXMA4K2F35I3N

The 5SGXMA4K2F35I3N is a Stratix V GX field programmable gate array (FPGA) optimized for designs that require large programmable logic capacity, extensive on-chip memory, and a high I/O count. As a Stratix V GX device, it is part of the Stratix V family covered by the device datasheet and is supplied in an industrial temperature grade.

Key on-chip resources include 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and 600 user I/Os. The device is supplied in a 1152-ball FCBGA package and operates over a low core-voltage range suited to modern high-density FPGA architectures.

Key Features

• Programmable Logic 420,000 logic elements for implementing large, complex digital designs and custom hardware accelerators.
• Embedded Memory Approximately 37.9 Mbits of on-chip RAM to support buffering, caching, and large state machines without external memory.
• I/O Capability 600 user I/Os to accommodate dense peripheral interfacing and multi-channel system integration.
• Package & Mounting 1152-ball BGA package (listed as 1152-BBGA, FCBGA / 1152-FBGA, 35×35 footprint) with surface-mount mounting for high-density board designs.
• Power Core supply range of 820 mV to 880 mV to match the device’s specified operating conditions.
• Temperature & Grade Industrial grade with an operating temperature range of –40 °C to 100 °C for deployment in thermally demanding environments.
• Regulatory RoHS compliant.
• Stratix V GX Family Characteristics As documented in the Stratix V device datasheet, the GX family includes transceiver speed-grade options used across high-bandwidth applications.

Typical Applications

• Communications Infrastructure High I/O count and substantial embedded memory make this device suitable for packet processing, line cards, and protocol bridging.
• High-Density Digital Processing Large logic element count supports hardware acceleration, signal processing, and custom compute fabrics.
• Industrial Controls Industrial temperature grading and robust I/O enable deployment in factory automation and process-control systems requiring extended temperature operation.
• Test & Measurement Abundant logic and memory resources support real-time data acquisition, buffering, and complex timing/state machine implementations.

Unique Advantages

• High Logic Capacity: 420,000 logic elements provide the headroom to implement large-scale digital designs without partitioning across multiple devices.
• Generous On-Chip Memory: Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks, simplifying board design.
• Extensive I/O: 600 user I/Os enable connectivity to numerous peripherals and multi-channel interfaces while minimizing the need for external multiplexing.
• Industrial Temperature Range: Rated for –40 °C to 100 °C operation, making the device suitable for systems that must operate reliably in harsh thermal conditions.
• Compact, High-Density Package: The 1152-ball FCBGA package (35×35) supports surface-mount assembly for compact, high-performance boards.
• Standards-Conscious Supply: RoHS compliance supports environmental and regulatory objectives in product development.

Why Choose 5SGXMA4K2F35I3N?

The 5SGXMA4K2F35I3N combines substantial programmable logic, significant embedded memory, and a high I/O count in a single industrial-grade Stratix V GX FPGA package. These attributes make it well suited to complex digital systems that require integration of large logic designs, substantial on-chip buffering, and extensive peripheral interfacing.

Designed for engineers and system architects who need scalable hardware resources with reliable operating margins, this device offers a balance of integration and ruggedness for industrial and communications-focused designs backed by the Stratix V device family documentation.

If you would like pricing, availability, or a custom quote for the 5SGXMA4K2F35I3N, submit an inquiry to request a quote or further technical information.