5SGXMA4K2F40C1N

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1517-BBGA, FCBGA

Quantity 165 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4K2F40C1N – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMA4K2F40C1N is a Stratix V GX family FPGA from Intel, delivered in a 1517-BBGA FCBGA package. This commercial-grade device integrates a large programmable logic fabric and abundant on-chip memory to support complex digital designs.

Key on-chip resources include 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and 600 user I/O pins. The device is specified for surface-mount assembly with a core supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Large programmable logic capacity — 420,000 logic elements to implement complex custom logic and state machines.
  • Embedded memory — approximately 37.9 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
  • High I/O count — 600 user I/O pins to accommodate wide buses, parallel interfaces, and dense system connectivity.
  • Family and architecture — Part of the Stratix V GX FPGA family with documented electrical and switching characteristics in the Stratix V device datasheet.
  • Power and supply — Core voltage supply range of 870 mV to 930 mV for consistent core power domain planning.
  • Package and mounting — 1517-BBGA (1517-FBGA supplier package, 40×40) in a surface-mount form factor for compact board-level integration.
  • Operating conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental compliance — RoHS compliant.

Unique Advantages

  • High integration density: 420,000 logic elements reduce the need for external CPLDs or discrete logic, simplifying system BOMs.
  • Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM enables large buffering, frame storage, and deep state machines without external memory.
  • Extensive I/O resources: 600 I/O pins support wide parallel interfaces and numerous peripheral connections on a single device.
  • Compact high-pin package: The 1517-BBGA FCBGA package packs high I/O and logic density into a compact surface-mount footprint suitable for space-constrained boards.
  • Tight core voltage window: The 870 mV–930 mV supply range supports predictable core power budgeting and domain planning.
  • Commercial-grade readiness and compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for general commercial deployments.

Why Choose 5SGXMA4K2F40C1N?

The 5SGXMA4K2F40C1N is positioned for designs that require large programmable logic capacity, significant embedded memory, and a high I/O count in a compact surface-mount package. Its specification as a Stratix V GX family device provides designers with a known architecture and documented electrical characteristics to plan power, timing, and thermal budgets.

This device is well suited to commercial applications that need dense logic integration and on-chip RAM while maintaining RoHS compliance and standard commercial temperature operation. Choosing this part supports designs that prioritize integration density, ample I/O availability, and a narrow core supply domain.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMA4K2F40C1N.

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