5SGXMA4K2F35I3G

The 5SGXMA4K2F35I3G is a Stratix V GX family FPGA delivered in a 1152‑FBGA (35×35) package for surface-mount applications. The device integrates high logic density and on‑chip memory with a broad I/O complement, targeting demanding industrial and communications designs.

Designed for implementations that require large programmable logic capacity, substantial embedded memory, and extensive I/O, this Stratix V GX device supports the family’s high‑speed transceiver capabilities (transceiver data rates vary by speed grade) while operating across an industrial temperature range and a low-voltage core supply.

Key Features

• Logic Capacity — Provides 420,000 logic elements to implement complex digital functions and large FPGA designs.
• Embedded Memory — Approximately 38 Mbits of on‑chip RAM for buffering, lookup tables, and on‑chip data storage.
• I/O Density — Up to 600 I/O pins to connect to high‑pin‑count systems, peripherals, and parallel interfaces.
• Package & Mounting — 1152‑BBGA, FCBGA supplier package (1152‑FBGA, 35×35) in a surface‑mount form factor for compact board integration.
• Power Supply — Core voltage supply range of 820 mV to 880 mV to support low‑voltage core operation.
• Temperature & Grade — Industrial grade device rated for operation from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Standards & Compliance — RoHS‑compliant material status for environmental compliance in assembly and distribution.

Typical Applications

• Communications Infrastructure — High logic count and family transceiver capability make the device suitable for networking line cards, protocol processing, and packet handling.
• Signal Processing — Large embedded memory and dense logic enable real‑time DSP, filtering, and data aggregation functions.
• Industrial Control — Industrial temperature rating and extensive I/O support sensor fusion, motion control, and automation tasks.
• High‑Density System Integration — High I/O count and compact 1152‑FBGA package allow integration into space‑constrained, high‑performance assemblies.

Unique Advantages

• High Logic Integration: 420,000 logic elements reduce the need for multiple devices and simplify board-level integration.
• Substantial On‑Chip Memory: Approximately 38 Mbits of embedded RAM supports buffering and large data structures without external memory.
• Extensive Connectivity: 600 I/Os provide direct interfacing to a wide range of peripherals and parallel buses.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for industrial applications with wide temperature swings.
• Compact, Surface‑Mount Package: 1152‑FBGA (35×35) enables high I/O density in a compact footprint for modern board designs.
• Low‑Voltage Core: Core supply range of 0.82–0.88 V supports low‑voltage FPGA designs and power budgeting at the system level.

Why Choose 5SGXMA4K2F35I3G?

The 5SGXMA4K2F35I3G combines large programmable logic capacity, significant embedded memory, and high I/O density in a compact surface‑mount package, making it well suited for industrial and communications applications that demand integration and robustness. Its industrial temperature rating and RoHS compliance support deployment in temperature‑challenging and environmentally compliant designs.

Engineers and system designers seeking a high‑density Stratix V GX family device for complex logic, buffering, and extensive external interfacing will find this FPGA a capable option that aligns with demanding performance and integration requirements.

Request a quote or submit an RFQ to evaluate 5SGXMA4K2F35I3G for your next design project.