5SGXMA4K2F35I2LN

The 5SGXMA4K2F35I2LN is a Stratix V GX Field Programmable Gate Array (FPGA) in a 1152‑ball BGA package. It delivers high logic density and substantial on‑chip RAM for complex digital designs, with industrial temperature grading for extended-environment operation.

As a Stratix V GX family device, the series documentation indicates support for multiple transceiver speed grades; consult the device datasheet for specific transceiver speed grade options for this part. The device targets applications that require large logic capacity, significant embedded memory, and extensive I/O connectivity.

Key Features

• Core density — 420,000 logic elements (logic cells) to implement large, complex FPGA designs with extensive parallelism.
• Embedded memory — approximately 38 Mbits of on‑chip RAM for buffering, lookup tables, and high‑throughput data paths.
• I/O capacity — 600 user I/Os to support broad interfacing and multi‑channel designs.
• Transceiver options (Stratix V GX family) — family datasheet lists GX channel speed grades including 14.1 Gbps, 12.5 Gbps, and 8.5 Gbps; verify the specific speed grade for this device in the datasheet.
• Power supply — core voltage supply range of 820 mV to 880 mV for the device core.
• Package — 1152‑BBGA, FCBGA (supplier device package: 1152‑FBGA, 35×35 mm) for high‑density board implementations.
• Operating environment — Industrial grade with operating temperature range from ‑40 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• Networking & Communications — use the device’s large logic capacity and family transceiver speed grades to implement packet processing, protocol engines, and multi‑channel aggregation.
• High‑Performance Signal Processing — implement complex DSP pipelines and custom accelerators using the extensive logic resources and embedded RAM.
• Industrial Control & Automation — industrial temperature rating and broad I/O count enable control systems, motion control, and sensor aggregation in rugged environments.
• Test & Measurement — leverage high logic density and abundant I/Os for data acquisition, real‑time analysis, and multi‑channel instrumentation.

Unique Advantages

• High integration density: 420,000 logic elements and ~38 Mbits of embedded RAM reduce external component requirements and simplify system design.
• Extensive interfacing: 600 I/Os accommodate complex front‑end connectivity and multiple peripheral domains without extensive multiplexing.
• Industrial temperature range: Rated for ‑40 °C to 100 °C to support deployment in demanding environments.
• Flexible package for dense boards: 1152‑ball FCBGA package provides a compact footprint for high‑pin‑count designs.
• Standards‑aware device family: Stratix V GX family documentation details transceiver speed grades to match application bandwidth requirements; verify device speed grade per the datasheet.

Why Choose 5SGXMA4K2F35I2LN?

This Stratix V GX device positions itself where high logic capacity, significant embedded memory, and broad I/O are required in industrial environments. Its combination of 420,000 logic elements, approximately 38 Mbits of on‑chip RAM, and 600 I/Os makes it suitable for demanding signal processing, communications, and control applications that need large programmable fabric and robust thermal performance.

Backed by the Stratix V family documentation and electrical specifications, the device offers a clearly defined power and temperature envelope (820–880 mV core supply, ‑40 °C to 100 °C) and RoHS compliance for long‑term deployment considerations.

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