5SGXMA4K2F40C2N

The 5SGXMA4K2F40C2N is a Stratix® V GX field-programmable gate array (FPGA) from Intel, provided in a 1517-BBGA / 1517-FBGA (40×40) package for surface-mount assembly. It delivers a high on-chip resource set—420,000 logic elements and approximately 37.9 Mbits of embedded memory—designed for demanding commercial programmable-logic implementations.

This device targets commercial-temperature designs (0 °C to 85 °C) that require large logic capacity, extensive I/O connectivity, and a low-voltage core supply range (0.87 V to 0.93 V). It is RoHS compliant.

Key Features

• Core Logic Capacity  420,000 logic elements suitable for large, complex logic and custom hardware implementations.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support large data buffers, state machines, and memory-intensive functions.
• I/O Density  600 user I/Os to support extensive peripheral and board-level interfacing without external multiplexing.
• Package & Mounting  1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for compact system integration.
• Power  Core voltage supply range of 870 mV to 930 mV, enabling designs that target low-voltage FPGA core operation.
• Operating Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic  Use the large logic capacity and embedded RAM to implement complex custom logic, datapaths, and control systems.
• I/O-intensive interfacing  Leverage 600 user I/Os for designs that require broad connectivity to sensors, peripherals, or multiple board-level interfaces.
• Commercial embedded systems  Designed for commercial-temperature deployments (0 °C to 85 °C) where RoHS compliance and high integration are required.
• Prototype and development platforms  Ideal for advanced FPGA-based prototyping where significant logic and memory resources are needed in a surface-mount BGA package.

Unique Advantages

• High logic density: 420,000 logic elements enable implementation of large-scale digital functions without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O: 600 I/Os simplify system wiring and reduce the need for external multiplexers or expanders.
• Compact BGA packaging: 1517-BBGA / 1517-FBGA (40×40) package supports high-density board layouts and surface-mount assembly processes.
• Commercial-grade operation: Specified for 0 °C to 85 °C operation to match commercial system requirements.
• Regulatory readiness: RoHS compliance supports environmentally regulated product builds.

Why Choose 5SGXMA4K2F40C2N?

The 5SGXMA4K2F40C2N positions itself as a high-capacity Stratix V GX FPGA for commercial programmable-logic designs that demand large logic arrays, significant embedded memory, and broad I/O connectivity in a BGA surface-mount package. Its combination of 420,000 logic elements, approximately 37.9 Mbits of on-chip RAM, and 600 I/Os makes it well suited to consolidate complex logic and interfacing tasks into a single device.

Manufactured by Intel and provided in a compact 1517-BBGA/1517-FBGA form, this device supports developers and procurement teams who require a scalable, RoHS-compliant commercial FPGA platform with defined operating voltage and temperature ranges.

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