5SGXMA4K2F40C2WN

The 5SGXMA4K2F40C2WN is a Stratix V GX field programmable gate array (FPGA) from Intel, supplied in a 1517-BBGA FCBGA package (supplier package 1517-FBGA, 40×40). It delivers a high-density programmable fabric with approximately 420,000 logic elements and about 37.9 Mbits of embedded memory for complex digital designs.

With up to 600 I/O pins, a commercial temperature grade (0 °C to 85 °C), and a core voltage supply range of 870 mV to 930 mV, this device targets demanding, high-capacity FPGA implementations where integration density and I/O count are primary requirements.

Key Features

• Core Capacity  Approximately 420,000 logic elements to support large-scale programmable logic and complex combinational/sequential designs.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM for buffering, state storage, and high-throughput data paths.
• I/O Density  Up to 600 I/O pins to accommodate wide parallel interfaces, multiple high-pin-count peripherals, or extensive board-level connectivity.
• Package & Mounting  1517-BBGA FCBGA package (supplier package 1517-FBGA, 40×40); surface-mount mounting type for standard PCB assembly flows.
• Power Supply  Core voltage supply specified between 870 mV and 930 mV to match targeted system power architectures.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial-grade deployments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital systems  Implement large custom logic and control functions that require hundreds of thousands of logic elements and substantial on-chip RAM.
• Multi-interface platforms  Designs needing extensive I/O connectivity—up to 600 pins—for parallel buses, multi-channel data acquisition, or board-level expansion.
• Memory-intensive processing  Applications that rely on significant embedded RAM for buffering, packet processing, or intermediate data storage within the FPGA fabric.

Unique Advantages

• High integration density: The large logic-element count and substantial embedded memory reduce the need for external peripherals, simplifying board design.
• Extensive I/O capability: Up to 600 I/Os enable broad connectivity options for complex system integration without additional interface chips.
• Commercial-grade thermal range: Rated 0 °C to 85 °C to match commercial product environments and standard system thermal designs.
• Standard surface-mount BGA packaging: The 1517-BBGA FCBGA package supports common PCB assembly processes for reliable deployment.
• RoHS compliant: Conforms to environmental requirements for lead-free assembly and regulatory compliance.

Why Choose 5SGXMA4K2F40C2WN?

The 5SGXMA4K2F40C2WN positions itself as a high-capacity Stratix V GX FPGA option for designers who need large logic resources, considerable on-chip memory, and substantial I/O in a commercial-grade device. Its package and electrical characteristics make it suitable for complex digital systems where integration density and I/O breadth reduce board-level complexity.

Choose this device for scalable designs that demand a balance of logic resources, embedded RAM, and high I/O count while maintaining commercial temperature operation and RoHS compliance.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the 5SGXMA4K2F40C2WN.