5SGXMA4K2F40C3G

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1517-BBGA, FCBGA

Quantity 430 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4K2F40C3G – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXMA4K2F40C3G is a Stratix V GX family FPGA in a 1517-BBGA FCBGA package, offering a high-density programmable logic platform for commercial electronic designs. It combines a large logic capacity with substantial on-chip memory and a high I/O count for complex system integration.

Key attributes include 420,000 logic elements, approximately 37.9 Mbits of embedded RAM, up to 600 user I/Os, and a commercial operating temperature range of 0 °C to 85 °C, making it suitable for demanding board-level applications that require scalable programmable logic and rich I/O connectivity.

Key Features

  • High-density logic  420,000 logic elements provide extensive resources for large, complex hardware designs and custom data-path implementations.
  • Embedded memory  Approximately 37.9 Mbits of on-chip RAM to support buffering, packet processing, and large FPGA state machines without external memory.
  • Extensive I/O  Up to 600 user I/Os enable dense interfacing to peripherals, buses, and external devices for flexible system integration.
  • Package options  Supplied in a 1517-BBGA (FCBGA) package with supplier device package listed as 1517-FBGA (40×40), suitable for high-pin-count board designs.
  • Power domain  Core supply operating range is specified at 820 mV to 880 mV, allowing designers to plan power delivery and sequencing precisely.
  • Commercial grade  Rated for commercial operation from 0 °C to 85 °C and RoHS compliant for regulatory and manufacturing requirements.
  • Surface-mount mounting  Designed for surface-mount assembly to support standard PCB manufacturing flows.

Typical Applications

  • High-density digital processing  Use the large logic element count and embedded RAM for complex algorithms, custom accelerators, and data-path implementations.
  • Interface aggregation and bridging  The 600 I/Os facilitate aggregation of multiple peripheral interfaces, protocol bridging, and board-level system glue logic.
  • Prototyping and system validation  Leverage the Stratix V GX family resources to prototype advanced digital systems and validate high-logic-count designs on production-like silicon.

Unique Advantages

  • Large programmable fabric:  420,000 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
  • Significant on-chip memory:  Approximately 37.9 Mbits of embedded RAM lowers dependency on external memory for buffering and state retention.
  • High I/O density:  600 user I/Os provide flexible connectivity to support complex peripheral and high-pin-count interfaces without external multiplexing.
  • Commercial temperature targeting:  Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic products and environments.
  • RoHS compliant:  Meets lead-free requirements to support modern manufacturing and regulatory needs.

Why Choose 5SGXMA4K2F40C3G?

This Stratix V GX FPGA part is positioned for designers who need a high-capacity, commercially rated programmable device with abundant on-chip memory and extensive I/O. Its combination of 420,000 logic elements, approximately 37.9 Mbits of embedded RAM, and 600 I/Os supports integration of complex digital subsystems and dense board-level designs while maintaining clear power and thermal specifications.

Choose 5SGXMA4K2F40C3G for projects requiring scalable logic resources and rich connectivity within a commercial temperature envelope and standard surface-mount package offering. The device’s documented electrical and operating characteristics allow precise planning of power delivery, thermal management, and system integration.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and support information for 5SGXMA4K2F40C3G.

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