5SGXMA4K2F40C3G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 430 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4K2F40C3G – Stratix® V GX Field Programmable Gate Array (FPGA)
The 5SGXMA4K2F40C3G is a Stratix V GX family FPGA in a 1517-BBGA FCBGA package, offering a high-density programmable logic platform for commercial electronic designs. It combines a large logic capacity with substantial on-chip memory and a high I/O count for complex system integration.
Key attributes include 420,000 logic elements, approximately 37.9 Mbits of embedded RAM, up to 600 user I/Os, and a commercial operating temperature range of 0 °C to 85 °C, making it suitable for demanding board-level applications that require scalable programmable logic and rich I/O connectivity.
Key Features
- High-density logic 420,000 logic elements provide extensive resources for large, complex hardware designs and custom data-path implementations.
- Embedded memory Approximately 37.9 Mbits of on-chip RAM to support buffering, packet processing, and large FPGA state machines without external memory.
- Extensive I/O Up to 600 user I/Os enable dense interfacing to peripherals, buses, and external devices for flexible system integration.
- Package options Supplied in a 1517-BBGA (FCBGA) package with supplier device package listed as 1517-FBGA (40×40), suitable for high-pin-count board designs.
- Power domain Core supply operating range is specified at 820 mV to 880 mV, allowing designers to plan power delivery and sequencing precisely.
- Commercial grade Rated for commercial operation from 0 °C to 85 °C and RoHS compliant for regulatory and manufacturing requirements.
- Surface-mount mounting Designed for surface-mount assembly to support standard PCB manufacturing flows.
Typical Applications
- High-density digital processing Use the large logic element count and embedded RAM for complex algorithms, custom accelerators, and data-path implementations.
- Interface aggregation and bridging The 600 I/Os facilitate aggregation of multiple peripheral interfaces, protocol bridging, and board-level system glue logic.
- Prototyping and system validation Leverage the Stratix V GX family resources to prototype advanced digital systems and validate high-logic-count designs on production-like silicon.
Unique Advantages
- Large programmable fabric: 420,000 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
- Significant on-chip memory: Approximately 37.9 Mbits of embedded RAM lowers dependency on external memory for buffering and state retention.
- High I/O density: 600 user I/Os provide flexible connectivity to support complex peripheral and high-pin-count interfaces without external multiplexing.
- Commercial temperature targeting: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic products and environments.
- RoHS compliant: Meets lead-free requirements to support modern manufacturing and regulatory needs.
Why Choose 5SGXMA4K2F40C3G?
This Stratix V GX FPGA part is positioned for designers who need a high-capacity, commercially rated programmable device with abundant on-chip memory and extensive I/O. Its combination of 420,000 logic elements, approximately 37.9 Mbits of embedded RAM, and 600 I/Os supports integration of complex digital subsystems and dense board-level designs while maintaining clear power and thermal specifications.
Choose 5SGXMA4K2F40C3G for projects requiring scalable logic resources and rich connectivity within a commercial temperature envelope and standard surface-mount package offering. The device’s documented electrical and operating characteristics allow precise planning of power delivery, thermal management, and system integration.
Request a quote or submit a procurement inquiry to obtain pricing, availability, and support information for 5SGXMA4K2F40C3G.

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