5SGXMA4K2F40I2LG

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1517-BBGA, FCBGA

Quantity 1,283 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4K2F40I2LG – Stratix® V GX FPGA, 420,000 logic elements, 600 I/Os

The 5SGXMA4K2F40I2LG is an Intel Stratix V GX field-programmable gate array supplied in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. This industrial-grade FPGA delivers a high logic capacity with extensive embedded memory and a large I/O count for complex, high-density designs. Key value propositions include high integration, significant on-chip RAM, wide I/O availability, and operation across industrial temperature and low-voltage core ranges.

Key Features

  • Logic Capacity — 420,000 logic elements (cells) to support large-scale digital designs and complex custom logic implementations.
  • Embedded Memory — approximately 37.9 Mbits of on-chip RAM (37,888,000 bits) for buffering, FIFOs, and large local data storage.
  • I/O Density — 600 user I/O pins to accommodate broad interfacing needs and multiple high-pin-count peripherals.
  • Package & Mounting — 1517-BBGA (1517-FBGA, 40×40) package in a surface-mount footprint for board-level integration.
  • Power Supply Range — core voltage supply specified between 820 mV and 880 mV for the device core.
  • Industrial Temperature Grade — rated for operation from −40 °C to 100 °C for industrial-environment deployments.
  • RoHS Compliant — meets RoHS requirements for reduced hazardous substances.

Unique Advantages

  • High integration density: 420,000 logic elements reduce external component count by allowing more logic to be implemented on-chip.
  • Substantial embedded memory: approximately 37.9 Mbits of RAM enables on-chip data buffering and local storage for performance-sensitive logic.
  • Extensive I/O capability: 600 I/Os support complex connectivity, multiple interfaces, and flexible board-level partitioning.
  • Industrial operating range: −40 °C to 100 °C rating supports deployment in demanding temperature environments.
  • Low-voltage core operation: defined core supply from 0.820 V to 0.880 V enables predictable power planning for system designs.
  • Surface-mount BBGA package: 1517-BBGA (40×40) package offers a compact, manufacturable footprint for high-density PCBs.

Why Choose 5SGXMA4K2F40I2LG?

The 5SGXMA4K2F40I2LG positions itself for projects that require substantial on-chip logic and memory capacity with wide I/O availability, all in an industrial-grade FPGA package. Its specific combination of 420,000 logic elements, roughly 37.9 Mbits of embedded RAM, and 600 I/Os makes it suitable for high-density, performance-oriented FPGA implementations where integration and reliability across a −40 °C to 100 °C range are important.

Design teams seeking scalable logic capacity, large local memory, and a well-specified low-voltage core supply can rely on the clear, verifiable specifications of this Stratix V GX device to inform power, thermal, and PCB integration decisions.

Request a quote or submit an inquiry to receive pricing and availability for 5SGXMA4K2F40I2LG.

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