5SGXMA4K2F40I3G

The 5SGXMA4K2F40I3G is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, delivering high-density programmable logic and extensive I/O in an industrial-grade package. It combines 420,000 logic elements with substantial on-chip RAM and a 1517-BBGA FCBGA package to address applications that require significant logic capacity, memory, and I/O integration.

As a member of the Stratix V GX family, the device is documented in the series datasheet for electrical and switching characteristics and is offered for designs that require a mix of performance, integration, and industrial temperature operation.

Key Features

• High-density logic — 420,000 logic elements for complex programmable logic implementations and deep feature integration.
• Embedded memory — Approximately 37.9 Mbits of on-chip RAM to support buffering, FIFO, and memory-intensive logic functions.
• Rich I/O count — 600 I/Os to support dense external interfacing and multi-channel connectivity.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Power and core supply — Core voltage supply range of 820 mV to 880 mV for integration with regulated power systems.
• Package and mounting — 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) with surface-mount mounting suitable for compact board-level integration.
• Series transceiver capability (Stratix V GX) — Stratix V GX devices in the series datasheet include transceiver speed grades (series-level information) for high-speed channel support as documented in the Stratix V device datasheet.

Typical Applications

• Industrial control and automation — Industrial temperature rating and high logic density enable robust control, signal processing, and real-time decision logic in factory and process environments.
• High-density interfacing — Large I/O count and significant on-chip RAM support multi-channel data aggregation, protocol bridging, and interface conversion tasks.
• Communications and networking — As part of the Stratix V GX family, the device is suitable for designs that benefit from series transceiver capabilities and high logic/memory integration.

Unique Advantages

• High integration density: 420,000 logic elements reduce the need for multiple devices and simplify system architecture.
• Large on-chip memory: Approximately 37.9 Mbits of embedded RAM supports buffering, packet processing, and data staging without extensive external memory.
• Extensive I/O scalability: 600 I/Os enable dense external connectivity and flexible board-level signal routing.
• Designed for industrial environments: −40 °C to 100 °C operating range aligns with industrial deployment requirements.
• Compact FCBGA package: 1517-BBGA / 1517-FBGA (40×40) surface-mount package balances board space and thermal considerations for high-density designs.
• Documented series characteristics: Electrical and switching characteristics for the Stratix V family are provided in the series datasheet for detailed design planning.

Why Choose 5SGXMA4K2F40I3G?

The 5SGXMA4K2F40I3G positions itself where high logic capacity, substantial embedded memory, and large I/O counts are required within industrial temperature environments. Its FCBGA footprint and defined core-voltage range make it suitable for compact, high-density boards that demand reliable programmable logic and ample on-chip resources.

Ideal for teams designing industrial control systems, dense interface modules, or communication equipment that leverage the documented characteristics of the Stratix V GX family, this device offers a documented hardware platform for robust, scalable designs.

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