5SGXMA4K2F40I3N

The 5SGXMA4K2F40I3N is a Stratix® V GX FPGA offering high-density programmable logic and on-chip memory in a 1517-ball FCBGA package. It provides substantial logic capacity, approximately 38 Mbits of embedded memory, and up to 600 general-purpose I/Os, making it suitable for designs that require large logic fabrics, extensive I/O, and robust thermal range.

Rated for industrial operation, this device targets applications that need scalable programmable silicon with a wide operating temperature range and defined core supply requirements.

Key Features

• Logic Capacity  420,000 logic elements (cells) for implementing large-scale digital designs and complex logic functions.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM to support buffering, lookup tables, and large state machines.
• I/O Availability  Up to 600 I/Os to support dense external interfacing and multi‑port connectivity.
• Package  1517‑BBGA (FCBGA) supplier device package 1517‑FBGA (40×40) for high pin count surface-mount integration.
• Power Supply  Core voltage supply specified from 820 mV to 880 mV, enabling designs that target the device's required operating point.
• Temperature Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Mounting  Surface mount package suitable for modern PCB assembly practices.
• Compliance  RoHS compliant for regulatory and environmental considerations.

Typical Applications

• High‑performance signal processing  Large logic count and significant embedded RAM enable implementation of complex DSP pipelines and algorithm acceleration.
• Networking and communications  Extensive I/O and Stratix V GX family characteristics support multi‑lane interfaces and dense connectivity requirements.
• Industrial control systems  Industrial temperature rating and robust package make the device suitable for factory automation, motion control, and other industrial applications.

Unique Advantages

• Large programmable fabric: 420,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board-level component count.
• Significant on‑chip memory: Approximately 38 Mbits of embedded RAM supports large data buffering and state storage without external memory.
• High I/O density: 600 I/Os enable complex peripheral interfaces and high port-count system architectures.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in temperature‑challenging environments.
• High-density FCBGA packaging: 1517-ball FCBGA provides the pin count needed for demanding designs while supporting surface-mount assembly.
• Regulatory compliance: RoHS compliance aligns with environmental and manufacturing requirements.

Why Choose 5SGXMA4K2F40I3N?

The 5SGXMA4K2F40I3N combines a very large logic element count with substantial embedded memory and a high I/O count in a single industrial‑grade FCBGA package. It is positioned for system designs that require consolidation of complex functions, extensive data buffering, and numerous external interfaces while operating across a wide temperature range.

For engineering teams targeting scalable, high‑density programmable solutions, this Stratix V GX device delivers the determinable specifications—logic elements, on‑chip RAM, I/O count, core voltage range, and industrial temperature rating—needed to assess fit and accelerate design decisions.

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