5SGXMA4K3F35C2LG

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 551 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4K3F35C2LG – Stratix® V GX FPGA, 420,000 logic elements, ~37.9 Mbits RAM, 600 I/Os, 1152-BBGA

The 5SGXMA4K3F35C2LG is a Stratix V GX field programmable gate array (FPGA) in a 1152-ball FCBGA package targeted at high-density, high-performance digital designs. It combines a very large logic capacity and embedded memory with a high I/O count and low-voltage core operation to support complex system integration on compact boards.

As part of the Stratix V GX family, this device is designed for applications that require substantial programmable logic, on-chip RAM, and high-speed serial capabilities (family-level transceiver support described in the Stratix V GX documentation).

Key Features

  • Core Logic Capacity  420,000 logic elements provide extensive programmable fabric for complex algorithms, control logic, and custom accelerators.
  • Embedded Memory  Approximately 37.9 Mbits of on-chip RAM for buffering, FIFOs, and intermediate data storage.
  • I/O and Package  600 I/Os and a 1152-ball BGA (1152-FBGA, 35×35 mm) FCBGA package deliver dense board-level connectivity and support for wide parallel interfaces.
  • Power and Voltage  Core supply range 0.820–0.880 V to align with modern low-voltage FPGA power architectures.
  • Operating Temperature  Commercial grade operation from 0 °C to 85 °C for standard temperature-range applications.
  • High-Speed Transceiver Capability (family)  As a Stratix V GX family member, the series documentation specifies GX transceiver channel speed options for high-speed serial links (see family datasheet for details).
  • Mounting and Compliance  Surface-mount FCBGA package and RoHS compliance for modern PCB assembly and regulatory requirements.

Typical Applications

  • High-speed networking & telecom  Large logic capacity and family-level GX transceiver capability make it suitable for line cards, packet processing, and protocol bridging.
  • High-performance signal processing  Ample embedded RAM and logic resources support DSP pipelines, filtering, and real-time data processing tasks.
  • System prototyping & integration  Dense I/O and a compact 1152-ball FCBGA package enable integration of complex prototypes and system-on-board implementations.
  • Custom compute acceleration  Programmable fabric and abundant logic elements allow hardware acceleration of compute-intensive algorithms and offload tasks from CPUs.

Unique Advantages

  • High logic density: 420,000 logic elements let you implement large-scale designs without partitioning across multiple devices.
  • Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching requirements.
  • Extensive I/O count: 600 I/Os provide flexibility for wide data buses, multiple interfaces, and parallel peripherals.
  • Compact, manufacturable package: 1152-ball FCBGA (35×35 mm) supports dense PCB layouts while remaining surface-mount friendly.
  • Low-voltage core operation: 0.820–0.880 V core supply aligns with modern power delivery strategies to optimize system power budgets.
  • RoHS compliant: Conforms to lead-free assembly requirements for environmentally conscious designs.

Why Choose 5SGXMA4K3F35C2LG?

This Stratix V GX FPGA balances extensive logic resources, significant embedded memory, and a high I/O count in a single, compact FCBGA package—making it a solid choice for teams designing complex digital systems that require on-chip capacity and dense board-level integration. Its commercial temperature rating and RoHS compliance suit a wide range of standard embedded and telecommunications products.

Designers and procurement teams pursuing scalable, high-capacity FPGA solutions will find the 5SGXMA4K3F35C2LG appropriate for applications where programmable logic density, embedded RAM, and connectivity options drive system capability and flexibility. Refer to the Stratix V GX family documentation for additional details on transceiver and speed-grade options.

Request a quote or contact sales to discuss availability, lead times, and pricing for the 5SGXMA4K3F35C2LG.

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