5SGXMA4K3F35C2N

The 5SGXMA4K3F35C2N is a Stratix® V GX family FPGA in a 1152‑BBGA FCBGA package, designed for complex programmable logic implementations. It delivers high logic density, significant on‑chip memory, and a large I/O count for commercial‑temperature systems.

This device targets designs that require substantial programmable resources and extensive external interfacing, providing a compact, surface‑mount package with clearly defined operating and power ranges for reliable commercial use.

Key Features

• Logic Capacity  420,000 logic elements, enabling implementation of complex digital designs and large-scale programmable logic functions.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM for data buffering, tables, and embedded storage.
• I/O Count  600 I/O pins to support wide external interfacing and multi‑channel connectivity.
• Package  1152‑BBGA (supplier package: 1152‑FBGA, 35 × 35 mm) in a surface‑mount footprint for high‑pin‑count board integration.
• Power  Core supply voltage specified from 870 mV to 930 mV to match system power rails and design constraints.
• Temperature Grade  Commercial grade with an operating range of 0 °C to 85 °C suitable for commercial deployments.
• RoHS Compliance  RoHS‑compliant device for environmentally regulated applications.

Typical Applications

• High‑density FPGA designs  Use the 420,000 logic elements and ample embedded RAM to implement large, integrated programmable functions and custom accelerators.
• Multi‑interface systems  Leverage 600 I/O for designs requiring numerous external connections, parallel interfaces, or multi‑channel I/O aggregation.
• Prototyping and system validation  Large logic and memory resources support complex prototypes and functional validation tasks on commercial‑temperature hardware.

Unique Advantages

• High logic density: 420,000 logic elements allow consolidation of extensive functionality into a single device, reducing BOM complexity.
• Substantial on‑chip memory: Approximately 37.9 Mbits of embedded RAM supports large data sets, buffering, and state storage without immediate external memory dependence.
• Extensive I/O capacity: 600 I/O pins enable broad external connectivity for multi‑channel and multi‑peripheral systems.
• Compact, high‑pin package: 1152‑BBGA (35 × 35 mm) minimizes board area while providing a dense pinout for complex system routing.
• Commercial operation window: Rated for 0 °C to 85 °C to meet the environmental requirements of commercial applications.
• Controlled core voltage range: Defined 870 mV–930 mV supply specification simplifies power budgeting and margin planning.

Why Choose 5SGXMA4K3F35C2N?

The 5SGXMA4K3F35C2N pairs very high programmable logic capacity with substantial embedded memory and a broad I/O complement in a compact surface‑mount BBGA package. It is positioned for commercial designs that demand large on‑chip resources and extensive external interfacing while maintaining precise power and thermal operating windows.

This Stratix V GX device is appropriate for teams building complex, high‑resource FPGA implementations that require scalability within the Stratix V family and predictable commercial‑grade operation.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMA4K3F35C2N.