5SGXMA4K3F35C3WN

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 146 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4K3F35C3WN – Stratix® V GX FPGA, 420,000 logic elements, 1152‑BBGA

The 5SGXMA4K3F35C3WN is a Stratix V GX field‑programmable gate array (FPGA) in a commercial temperature grade. It delivers a high logic capacity fabric with on‑chip embedded memory and extensive I/O to support complex, programmable designs.

Designed for applications that require dense programmable logic, substantial embedded RAM, and large I/O counts, this device pairs a low‑voltage core supply with the Stratix V GX family capabilities described in the device datasheet.

Key Features

  • Core Logic  420,000 logic elements provide a high‑capacity programmable fabric for complex logic implementation.
  • Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM to support large data buffering, packet processing, and state storage.
  • I/O Density  Up to 600 user I/Os to interface with multiple parallel and serial peripherals or system-level buses.
  • Package  Available in a 1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, 35×35 mm) for high pin density and surface‑mount board assembly.
  • Power  Core voltage supply range: 820 mV to 880 mV (0.82–0.88 V) to match low‑voltage system power rails.
  • Temperature and Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Series-Level Transceiver Capability  Stratix V GX family transceiver speed grades are documented in the device datasheet (series information), providing options for high‑speed serial connectivity within the Stratix V GX offering.
  • Compliance  RoHS‑compliant construction for use in lead‑free assemblies.

Typical Applications

  • High‑performance data processing  Leverage the large logic element count and on‑chip memory for custom packet processing, signal processing algorithms, and hardware acceleration.
  • High‑density I/O systems  Use the 600 I/Os to aggregate multiple interfaces, front‑end peripherals, or high‑pin‑count system interconnects.
  • High‑speed serial connectivity  Employ the Stratix V GX family’s documented transceiver speed grades for applications that need high‑bandwidth serial links (series capability described in the datasheet).

Unique Advantages

  • High logic capacity: 420,000 logic elements reduce the need for multiple devices and simplify partitioning of large designs.
  • Substantial on‑chip RAM: Approximately 37.9 Mbits of embedded memory supports large buffers and state machines without external memory.
  • Extensive I/O: 600 I/Os enable broad system integration and flexible connectivity options.
  • Compact, high‑pin package: 1152‑BBGA FCBGA (supplier: 1152‑FBGA, 35×35) provides high density in a surface‑mount footprint.
  • Low‑voltage core supply: 0.82–0.88 V core operation aligns with modern low‑voltage system architectures.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C for a wide range of commercial applications.

Why Choose 5SGXMA4K3F35C3WN?

The 5SGXMA4K3F35C3WN positions itself as a high‑capacity Stratix V GX FPGA for commercial designs that demand significant programmable logic, large embedded memory, and a high I/O count in a compact BGA package. Its documented family transceiver capabilities and the device’s electrical characteristics make it suitable for system designs requiring dense logic integration and flexible connectivity.

This part is appropriate for engineering teams and procurement sourcing FPGAs for complex, high‑integration projects where on‑chip memory, I/O density, and a low‑voltage core are key selection criteria. The device benefits from Stratix V family documentation and vendor support resources referenced in the product datasheet.

Request a quote or submit an inquiry to receive pricing, lead time, and availability for the 5SGXMA4K3F35C3WN.

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