5SGXMA4K3F35C2WN

The 5SGXMA4K3F35C2WN is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1152‑FBGA (35×35) package for surface‑mount assembly. It provides large on‑chip logic capacity and embedded memory along with a high I/O count for designs that require significant integration of digital logic and I/O resources.

Designed for commercial‑grade applications, the device combines 420,000 logic elements with approximately 37.9 Mbits of embedded RAM and 600 I/O pins, enabling complex system integration while operating from a low core voltage range (870 mV to 930 mV).

Key Features

• Core Logic  420,000 logic elements (cells) to implement large-scale digital logic, signal processing, and custom hardware accelerators.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM for buffering, FIFOs, and memory‑intensive functions without external memory dependence.
• I/O Capacity  600 user I/O pins suited for high‑pin‑count designs and dense connectivity to peripherals, memory, and system interfaces.
• Power and Supply  Core voltage supply range of 870 mV to 930 mV to match system power architectures and optimize dynamic power behavior.
• Package and Mounting  1152‑FBGA (35×35) package case (1152‑BBGA, FCBGA), surface‑mount format for compact board real estate and reliable assembly.
• Commercial Grade  Rated for commercial temperature range with operating temperatures from 0 °C to 85 °C.
• Regulatory  RoHS compliant for designs targeting global markets with lead‑free manufacturing requirements.

Typical Applications

• Communications Infrastructure  Use the large logic capacity and high I/O count to implement protocol processing, packet parsing, and custom switching or routing functions.
• High‑Density Digital Processing  Leverage the extensive logic and embedded RAM for algorithm acceleration, DSP pipelines, and data buffering in compute‑intensive designs.
• Test & Measurement  Employ abundant I/O and on‑chip resources to build complex instrumentation front‑ends, data aggregation, and real‑time processing systems.

Unique Advantages

• High Logic Density: 420,000 logic elements provide headroom for large, complex designs without immediate migration to multiple devices.
• Substantial Embedded Memory: Approximately 37.9 Mbits of RAM reduces dependence on external memory for many buffering and staging requirements.
• Extensive I/O: 600 I/O pins enable dense connectivity and flexible interfacing to a variety of peripherals and system components.
• Compact BGA Package: 1152‑FBGA (35×35) allows integration into space‑constrained PCBs while supporting standard surface‑mount assembly processes.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation for mainstream electronic and embedded applications.
• RoHS Compliance: Supports lead‑free manufacturing and regulatory requirements for broad market acceptance.

Why Choose 5SGXMA4K3F35C2WN?

This Stratix V GX FPGA balances very large logic capacity, substantial on‑chip memory, and broad I/O to address demanding digital designs that require integration and flexibility in a single device. Its low core voltage range and surface‑mount FBGA package make it suitable for compact, power‑aware systems within the commercial temperature envelope.

The 5SGXMA4K3F35C2WN is well suited for engineers and procurement teams building communications, high‑density processing, or instrumentation products that benefit from a high‑capacity FPGA platform backed by Intel’s Stratix V family documentation and support.

Request a quote or submit an inquiry for 5SGXMA4K3F35C2WN to discuss availability and lead times for your next design.