5SGXMA4K3F35C2G

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 92 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4K3F35C2G – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXMA4K3F35C2G is a Stratix V GX family Field Programmable Gate Array (FPGA) optimized for designs that require high logic density, significant embedded memory, and a large number of I/O. This commercial-grade device provides a scalable programmable fabric suitable for applications that demand substantial on-chip resources and flexible I/O connectivity.

As a member of the Stratix V GX series, the device is built around the Stratix V architecture and targets use cases where core logic capacity, embedded memory, and interface density are primary considerations. Key value comes from a high count of logic elements, nearly 38 Mbits of on-chip RAM, and a 600-pin I/O footprint in a high-density BGA package.

Key Features

  • Logic Capacity  Approximately 420,000 logic elements to handle complex combinational and sequential logic tasks.
  • Embedded Memory  Approximately 37.9 Mbits of on-chip RAM for buffering, packet storage, or local data processing.
  • I/O Density  600 I/O pins to support large numbers of interfaces and parallel connections.
  • Power Supply  Core voltage supply range from 870 mV to 930 mV to match platform power rails and design constraints.
  • Package & Mounting  1152-BBGA / 1152-FBGA (35×35) surface-mount package for high-density board integration.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial-environment deployments.
  • RoHS Compliance  Manufactured to meet RoHS environmental standards.
  • Stratix V GX Family Characteristics  Member of the Stratix V GX series as described in the device datasheet, which documents family-level electrical and switching characteristics.

Typical Applications

  • High-density logic implementations  Large logic element count supports complex state machines, custom processors, and wide datapaths for compute- and control-intensive designs.
  • On-chip buffering and memory-centric designs  Approximately 37.9 Mbits of embedded RAM enables local data storage for packet buffering, look-up tables, and scratchpad memory.
  • Multi-interface systems  600 I/Os provide the capacity to connect numerous peripherals, parallel buses, and external devices for system integration and prototyping.

Unique Advantages

  • High logic integration: With roughly 420,000 logic elements, the device consolidates large designs into a single FPGA, reducing board-level complexity.
  • Substantial on-chip memory: Nearly 38 Mbits of embedded RAM reduces reliance on external memory for many buffering and working-data requirements.
  • Broad I/O support: 600 I/Os accommodate dense connectivity needs without additional multiplexing or external I/O expanders.
  • Commercial temperature suitability: Rated 0 °C to 85 °C for reliable operation in commercial environments and standard electronics deployments.
  • High-density BGA packaging: 1152-ball BGA (35×35) enables compact board layouts while supporting complex pinouts and signal routing.
  • Environmentally compliant: RoHS-compliant manufacturing supports regulatory and sustainability requirements.

Why Choose 5SGXMA4K3F35C2G?

The 5SGXMA4K3F35C2G positions itself for projects that need a combination of high logic capacity, significant embedded memory, and extensive I/O in a commercial-temperature FPGA. It is suitable for engineers consolidating complex functionality onto a single programmable device and for designs that benefit from dense BGA packaging and a well-documented Stratix V family platform.

Choosing this device delivers a balance of integration, usable on-chip resources, and package-level density for applications where consolidation, flexibility, and proven family-level electrical characteristics are priorities.

If you would like pricing, availability, or a custom quote for 5SGXMA4K3F35C2G, request a quote or submit a quote inquiry to evaluate this FPGA for your next design.

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