5SGXMA4K3F35C2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 92 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4K3F35C2G – Stratix® V GX Field Programmable Gate Array (FPGA)
The 5SGXMA4K3F35C2G is a Stratix V GX family Field Programmable Gate Array (FPGA) optimized for designs that require high logic density, significant embedded memory, and a large number of I/O. This commercial-grade device provides a scalable programmable fabric suitable for applications that demand substantial on-chip resources and flexible I/O connectivity.
As a member of the Stratix V GX series, the device is built around the Stratix V architecture and targets use cases where core logic capacity, embedded memory, and interface density are primary considerations. Key value comes from a high count of logic elements, nearly 38 Mbits of on-chip RAM, and a 600-pin I/O footprint in a high-density BGA package.
Key Features
- Logic Capacity Approximately 420,000 logic elements to handle complex combinational and sequential logic tasks.
- Embedded Memory Approximately 37.9 Mbits of on-chip RAM for buffering, packet storage, or local data processing.
- I/O Density 600 I/O pins to support large numbers of interfaces and parallel connections.
- Power Supply Core voltage supply range from 870 mV to 930 mV to match platform power rails and design constraints.
- Package & Mounting 1152-BBGA / 1152-FBGA (35×35) surface-mount package for high-density board integration.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial-environment deployments.
- RoHS Compliance Manufactured to meet RoHS environmental standards.
- Stratix V GX Family Characteristics Member of the Stratix V GX series as described in the device datasheet, which documents family-level electrical and switching characteristics.
Typical Applications
- High-density logic implementations Large logic element count supports complex state machines, custom processors, and wide datapaths for compute- and control-intensive designs.
- On-chip buffering and memory-centric designs Approximately 37.9 Mbits of embedded RAM enables local data storage for packet buffering, look-up tables, and scratchpad memory.
- Multi-interface systems 600 I/Os provide the capacity to connect numerous peripherals, parallel buses, and external devices for system integration and prototyping.
Unique Advantages
- High logic integration: With roughly 420,000 logic elements, the device consolidates large designs into a single FPGA, reducing board-level complexity.
- Substantial on-chip memory: Nearly 38 Mbits of embedded RAM reduces reliance on external memory for many buffering and working-data requirements.
- Broad I/O support: 600 I/Os accommodate dense connectivity needs without additional multiplexing or external I/O expanders.
- Commercial temperature suitability: Rated 0 °C to 85 °C for reliable operation in commercial environments and standard electronics deployments.
- High-density BGA packaging: 1152-ball BGA (35×35) enables compact board layouts while supporting complex pinouts and signal routing.
- Environmentally compliant: RoHS-compliant manufacturing supports regulatory and sustainability requirements.
Why Choose 5SGXMA4K3F35C2G?
The 5SGXMA4K3F35C2G positions itself for projects that need a combination of high logic capacity, significant embedded memory, and extensive I/O in a commercial-temperature FPGA. It is suitable for engineers consolidating complex functionality onto a single programmable device and for designs that benefit from dense BGA packaging and a well-documented Stratix V family platform.
Choosing this device delivers a balance of integration, usable on-chip resources, and package-level density for applications where consolidation, flexibility, and proven family-level electrical characteristics are priorities.
If you would like pricing, availability, or a custom quote for 5SGXMA4K3F35C2G, request a quote or submit a quote inquiry to evaluate this FPGA for your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018