5SGXMA4K2F40I3LN

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1517-BBGA, FCBGA

Quantity 920 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4K2F40I3LN – Stratix® V GX FPGA, approximately 420,000 logic elements, 1517‑BBGA

The 5SGXMA4K2F40I3LN is an Intel Stratix V GX field‑programmable gate array (FPGA) supplied in a 1517‑BBGA FCBGA package. It delivers very large logic capacity, substantial embedded RAM, and extensive I/O counts for designs that need high integration in a surface‑mount package.

Designed for industrial temperature operation, this device targets applications that require abundant on‑chip resources and robust operating margins while supporting low‑voltage core operation.

Key Features

  • Core Logic Capacity — Approximately 420,000 logic elements and about 158,500 LABs provide high-density programmable logic for complex designs.
  • Embedded Memory — Approximately 37.9 Mbits of on‑chip RAM to support large buffering, lookup tables, and state storage without external memory.
  • I/O Count — 600 user I/O pins to enable broad external interface options and high port density.
  • Transceiver and Series Information — Stratix V GX family electrical and switching characteristics are documented in the Stratix V device datasheet, including available transceiver speed grades for GX devices.
  • Power Supply — Core voltage range of 820 mV to 880 mV to match low‑voltage core power rails.
  • Package and Mounting — 1517‑BBGA (1517‑FBGA, 40×40) FCBGA supplier package in a surface‑mount form factor for high‑density board integration.
  • Temperature Rating — Industrial grade operation from −40 °C to 100 °C for extended environmental range.
  • Environmental Compliance — RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

  • High‑density programmable logic systems — Leverage approximately 420,000 logic elements and large embedded RAM to implement complex state machines, datapaths, and custom accelerators.
  • Multi‑port I/O subsystems — Use 600 I/O pins to connect numerous peripherals, interfaces, and front‑end devices without external I/O expanders.
  • Industrial and ruggedized designs — Industrial temperature range (−40 °C to 100 °C) supports deployments in harsher thermal environments where extended operating range is required.

Unique Advantages

  • Large integrated resource set: High logic element count and substantial embedded RAM reduce reliance on external components and lower BOM complexity.
  • Extensive I/O availability: 600 I/O pins enable high port density and flexible board-level connectivity for complex systems.
  • Low‑voltage core operation: Supported core supply range (820 mV–880 mV) aligns with modern low‑voltage power architectures.
  • Industrial temperature capability: Rated for −40 °C to 100 °C to support temperature‑sensitive applications and extended environmental operation.
  • Surface‑mount FCBGA package: 1517‑BBGA (40×40) format provides a compact, high‑pin‑count solution for space‑constrained PCBs.
  • Regulatory compatibility: RoHS compliance simplifies integration into commercially manufactured products.

Why Choose 5SGXMA4K2F40I3LN?

The 5SGXMA4K2F40I3LN balances very large programmable logic capacity, significant on‑chip memory, and a high I/O count in a compact 1517‑BBGA surface‑mount package. Its industrial temperature rating and low‑voltage core support make it suitable for designs that require both robustness and modern power efficiency.

This device is appropriate for engineering teams building complex, high‑resource FPGA designs that benefit from integrated memory, extensive I/O connectivity, and the documented Stratix V GX series electrical characteristics provided in the product datasheet.

Request a quote or submit an inquiry for part number 5SGXMA4K2F40I3LN to receive pricing and availability information tailored to your project needs.

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