5SGXMA4K2F40I3LCV
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 886 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4K2F40I3LCV – Stratix® V GX FPGA — 420,000 logic elements, 600 I/Os
The 5SGXMA4K2F40I3LCV is a Stratix® V GX Field Programmable Gate Array (FPGA) provided in a 1517-BBGA FCBGA package. This industrial-grade device offers high logic density, a large embedded memory footprint, and a substantial I/O count for complex system integration.
Designed for applications that require significant on-chip logic and I/O capacity, the device operates over an extended industrial temperature range and supports low-voltage core operation for integration into modern, power-conscious designs.
Key Features
- High Logic Capacity — 420,000 logic elements to implement complex digital functions and high-density designs.
- Embedded Memory — Approximately 38 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
- Broad I/O Count — 600 user I/Os to support large peripheral sets and multi-channel interfacing.
- Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C, suitable for industrial environments.
- Low-Voltage Core — Core supply range from 820 mV to 880 mV to match low-voltage system architectures.
- Package and Mounting — 1517-BBGA (1517-FBGA, 40×40) FCBGA package in a surface-mount form factor for compact board integration.
- RoHS Compliant — Meets RoHS requirements for lead-free assemblies.
Typical Applications
- Industrial Control and Automation — Industrial temperature grade and high logic density enable complex control algorithms and I/O aggregation for factory and process automation.
- High‑Density Digital Systems — Suitable for designs requiring extensive programmable logic and embedded memory to consolidate multiple functions into a single device.
- I/O‑Intensive Equipment — The 600 I/Os support equipment that needs broad external connectivity and parallel interfacing.
- Embedded System Integration — Low core voltage and surface-mount FCBGA packaging support compact, power-aware embedded designs.
Unique Advantages
- High logic integration: 420,000 logic elements reduce board-level component count by enabling more functionality inside a single FPGA.
- Substantial on-chip memory: Approximately 38 Mbits of embedded RAM supports large buffers and local data storage without external memory.
- Extensive I/O capability: 600 I/Os provide flexibility for connecting many peripherals, sensors, or parallel interfaces directly to the FPGA.
- Industrial robustness: –40 °C to 100 °C operating range ensures reliable operation in temperature-variable industrial environments.
- Compact, surface-mount package: 1517-BBGA (1517-FBGA, 40×40) FCBGA enables high-density PCB designs while supporting automated assembly processes.
- Low-voltage core operation: 820 mV–880 mV supply aligns with modern low-power system domains and helps manage overall power budgets.
Why Choose 5SGXMA4K2F40I3LCV?
The 5SGXMA4K2F40I3LCV positions itself as a high-capacity, industrial-grade Stratix V GX FPGA for designs that demand significant programmable logic, abundant on-chip memory, and a large number of I/Os. Its low-voltage core operation and surface-mount FCBGA package enable integration into compact, power-aware systems while maintaining industrial temperature performance.
Backed by Stratix V family documentation, this device is suited for engineering teams consolidating functionality onto a single programmable device to reduce BOM complexity, shorten signal paths, and simplify board-level designs.
Request a quote or submit a pricing inquiry to evaluate 5SGXMA4K2F40I3LCV for your next design.

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