5SGXMA4K2F40I2LN

The 5SGXMA4K2F40I2LN is a Stratix V GX FPGA IC in a 1517-ball FCBGA package designed for industrial-grade applications. It provides a high-density fabric with 420,000 logic elements and approximately 38 Mbits of embedded memory, combined with up to 600 I/O pins for large, complex designs. With a low nominal core supply range and wide operating temperature capability, this device targets demanding digital systems that require substantial integration and on-chip resources.

Key Features

• Logic Capacity — 420,000 logic elements (cells) to implement large-scale digital logic, custom datapaths, and complex state machines.
• Embedded Memory — Approximately 38 Mbits of on-chip RAM to support buffering, FIFOs, and local storage for high-throughput designs.
• I/O Density — Up to 600 I/O pins to interface with multiple peripherals, memory buses, and high-pin-count systems.
• Power and Core Voltage — Core voltage supply specified between 820 mV and 880 mV to align with the device’s operating requirements.
• Package & Mounting — 1517-BBGA (1517-FBGA, 40×40) FCBGA package, surface-mount for compact board-level integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to support industrial environments.
• Compliance — RoHS compliant for environmental and manufacturing compliance.

Typical Applications

• High-density digital processing — Use the device’s 420,000 logic elements and substantial embedded RAM to implement complex signal processing, protocol stacks, and custom accelerators.
• Multi-interface bridging — With up to 600 I/Os, the device is suitable for designs requiring many concurrent external interfaces or high-pin-count memory connectivity.
• Industrial control and automation — The industrial temperature rating and robust package make it suitable for embedded controllers and automation systems that need high logic integration.

Unique Advantages

• High on-chip integration: Combines hundreds of thousands of logic elements with tens of Mbits of embedded RAM to reduce external component count and simplify board design.
• Large I/O budget: Up to 600 I/Os enable complex interfacing and parallel data paths without extensive external multiplexing.
• Industrial robustness: Rated for −40 °C to 100 °C operation to address temperature-sensitive deployments in industrial settings.
• Compact packaging: 1517-ball FCBGA (40×40) allows high-density PCB layouts while supporting the device’s pin count and performance.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and supply chains.
• Predictable power envelope: Defined core voltage window (820–880 mV) assists power-supply planning and thermal management.

Why Choose 5SGXMA4K2F40I2LN?

The 5SGXMA4K2F40I2LN positions itself as a high-density, industrial-grade FPGA solution for engineers who need substantial logic capacity, abundant embedded memory, and many I/O pins in a single, compact package. Its defined core-voltage range and wide operating temperature make it suitable for designs where long-term reliability and predictable power planning are important.

This part is appropriate for teams building complex digital systems that benefit from on-chip integration—reducing BOM complexity, enabling tighter timing control, and consolidating functionality that would otherwise require multiple discrete components.

Request a quote or submit an inquiry for pricing and availability of part 5SGXMA4K2F40I2LN to the supplier or distributor handling your purchase needs.