5SGXMA4K2F40I3WN

The 5SGXMA4K2F40I3WN is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel. It delivers large programmable logic capacity and extensive I/O in a high-density FCBGA package for complex digital designs.

With 420,000 logic elements and approximately 37.9 Mbits of embedded memory, this device addresses designs that require significant on-chip logic and memory resources while supporting up to 600 I/Os. The device is specified for industrial temperature operation and a low-voltage core supply range.

Key Features

• Core Logic  420,000 logic elements providing substantial programmable logic capacity for large-scale designs.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support buffer, cache, and state storage requirements.
• I/O Density  Up to 600 I/Os to accommodate high-pin-count interfaces and complex board-level connectivity.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40); surface-mount for modern PCB assembly.
• Power Supply  Core voltage supply range specified at 820 mV to 880 mV for the device core.
• Temperature & Grade  Industrial grade operation with an operating temperature range of −40 °C to 100 °C.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Large-scale logic implementations that leverage 420,000 logic elements and significant on-chip RAM for complex algorithms and datapaths.
• High I/O interface platforms  Systems requiring many external connections or parallel interfaces can use the device’s support for up to 600 I/Os.
• Industrial control and automation  Industrial-temperature rated operation (−40 °C to 100 °C) enables deployment in factory-floor and other industrial environments.
• Memory-centric designs  Embedded memory (≈37.9 Mbits) supports buffering, caching, and on-chip storage to reduce external memory dependency.

Unique Advantages

• High programmable capacity: 420,000 logic elements allow large, integrated digital designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM helps minimize external memory needs and improves data throughput.
• Extensive I/O: Up to 600 I/Os supports dense board-level connectivity and complex interface requirements.
• Industrial temperature support: Rated for −40 °C to 100 °C operation to meet demanding environmental conditions.
• Compact, assembly-ready package: 1517-BBGA (FCBGA) surface-mount package enables high-density PCB designs and modern manufacturing processes.
• Low-voltage core operation: 820 mV to 880 mV supply range suitable for designs targeting low core power operation.

Why Choose 5SGXMA4K2F40I3WN?

The 5SGXMA4K2F40I3WN combines large logic capacity, significant embedded memory, and very high I/O count in a single industrial-grade Stratix V GX FPGA package. Its specification set makes it well suited for engineers who need integrated, high-density programmable logic with on-chip resources and robust temperature performance.

Backed by Stratix V family documentation, this device is appropriate for designs that demand scalable logic, substantial on-chip memory, and a compact FCBGA package for production assembly.

Request a quote or submit an inquiry for pricing and lead-time information to evaluate the 5SGXMA4K2F40I3WN for your next design.