5SGXMA4K3F35C2LN

The 5SGXMA4K3F35C2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. This high-density FPGA delivers substantial programmable logic capacity and a large I/O count in a compact FCBGA package, suited for designs that require significant on‑chip memory and extensive interfacing.

Designed and specified as a commercial-grade device, the part is provided in a 1152-BBGA (1152-FBGA, 35×35) surface-mount package and is RoHS compliant.

Key Features

• High Logic Density  Approximately 420,000 logic elements to support large, complex programmable designs.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to store buffers, tables, and on‑device data structures.
• Extensive I/O  600 user I/O pins for wide parallel interfaces and high channel counts.
• Package & Mounting  1152-BBGA, FCBGA package (supplier package: 1152-FBGA, 35×35); surface-mount mounting for board-level integration.
• Low-Voltage Core  Core voltage specified between 820 mV and 880 mV for compatibility with low-voltage power architectures.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C per the device specifications.
• Regulatory  RoHS compliant for lead-free manufacturing environments.
• Documented Electrical and Switching Characteristics  Part of the Stratix V family with detailed device electrical and switching specifications available in the Stratix V device datasheet.

Typical Applications

• High-density programmable logic  Implement large custom logic fabrics and complex state machines using the device’s substantial logic element count.
• Memory-intensive designs  Use the embedded RAM for buffering, lookup tables, and on-chip storage where off-chip memory access must be minimized.
• High I/O channel systems  Support applications requiring many parallel interfaces or broad bus interconnects with 600 available I/Os.

Unique Advantages

• High programmable capacity: Approximately 420,000 logic elements enable integration of large digital functions on a single device.
• Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces dependency on external memory, lowering BOM complexity.
• Large I/O complement: 600 I/Os provide flexibility for multi-channel and multi-interface systems.
• Compact, manufacturable package: 1152-FBGA (35×35) surface-mount package supports dense PCB routing while maintaining thermal and mechanical integrity.
• Low-voltage core operation: 820–880 mV supply range aligns with modern low-voltage power domains for efficient power delivery.
• Commercial-grade qualification and RoHS compliance: Specified operating range of 0 °C to 85 °C and RoHS compliance streamline adoption in commercial product lines.

Why Choose 5SGXMA4K3F35C2LN?

5SGXMA4K3F35C2LN positions itself as a high-density Stratix V GX FPGA option that combines a large programmable fabric, significant embedded memory, and broad I/O capability in a single commercial-grade FCBGA package. The device’s electrical and switching characteristics are documented within the Stratix V family datasheet, enabling engineering teams to plan power, timing, and system integration with confidence.

This FPGA is well suited for teams designing complex, memory‑heavy, and high‑I/O systems that require a compact, surface‑mount solution backed by Intel’s Stratix V device documentation and platform-level support.

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