5SGXMA4K3F35C3N

The 5SGXMA4K3F35C3N is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, offered in a 1152-BBGA FCBGA package. It delivers high on-chip logic capacity and memory with a large I/O count for complex, high-density programmable designs.

Commercial-grade (0 °C to 85 °C) operating specifications, a narrow core voltage supply range (820 mV to 880 mV), and RoHS compliance make this device suitable for demanding board-level deployments where integration and performance density are primary concerns.

Key Features

• Logic Capacity — 420,000 logic elements for implementing large-scale, custom digital logic and datapath functions.
• Embedded Memory — Approximately 38 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Resources — 600 user I/Os to support extensive peripheral, bus, and high-pin-count system interfaces.
• Package and Mounting — 1152-BBGA (FCBGA) package; supplier package listed as 1152-FBGA (35×35). Surface-mount mounting type for standard PCB assembly.
• Power Supply — Core voltage supply specified from 820 mV to 880 mV to enable predictable power budgeting and board-level power design.
• Operating Conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory — RoHS-compliant material status for environmental conformity.

Typical Applications

• High-density programmable logic — Implement large custom logic networks, complex state machines, and datapath acceleration using abundant logic elements and embedded RAM.
• High-pin-count system interfaces — Leverage 600 I/Os to connect multi-channel data paths, wide buses, or numerous peripherals on a single FPGA device.
• Communications and signaling — Use the Stratix V GX family device in systems that require on-chip resources and documented transceiver-capable architectures for high-speed serial and parallel link integration.

Unique Advantages

• Large on-chip integration: 420,000 logic elements and substantial embedded memory reduce reliance on external logic and memory devices, simplifying system design.
• High I/O density: 600 I/Os enable direct connection to multiple peripherals and parallel interfaces without extensive external multiplexing.
• Compact system footprint: 1152-BBGA FCBGA packaging provides a high-pin-count solution in a standardized surface-mount form factor for dense PCB layouts.
• Predictable power envelope: Defined core voltage range (820 mV–880 mV) assists in accurate power-supply planning and thermal considerations.
• Commercial-grade reliability: Specified operating temperature range of 0 °C to 85 °C and RoHS compliance support broad commercial deployment.

Why Choose 5SGXMA4K3F35C3N?

The 5SGXMA4K3F35C3N positions itself as a high-capacity, commercial-grade Stratix V GX FPGA well suited for designers who need extensive logic resources, significant embedded memory, and a large number of I/Os in a single, surface-mount package. Its defined electrical and thermal specifications allow engineers to plan power and thermal management precisely for board-level integration.

Backed by device documentation for the Stratix V family, this FPGA is appropriate for teams building dense programmable systems that require integration, scalability, and compliance with commercial environmental standards.

Request a quote or submit an inquiry to evaluate 5SGXMA4K3F35C3N for your next design and obtain pricing, lead-time, and availability information.