5SGXMA4K3F35C4WN

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 789 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4K3F35C4WN – Stratix® V GX Field Programmable Gate Array (FPGA), 420,000 logic elements

The 5SGXMA4K3F35C4WN is a Stratix V GX field programmable gate array (FPGA) IC in a 1152-FBGA (35×35) package. This commercial-grade device provides a high-density programmable logic fabric with 420,000 logic elements and approximately 37.888 Mbits of embedded memory.

With 600 I/O pins, a surface-mount 1152-BBGA/FCBGA package, and a core supply range of 820 mV to 880 mV, the device is specified for operation from 0 °C to 85 °C and is RoHS compliant.

Key Features

  • Core Logic  420,000 logic elements for implementing large-scale programmable logic designs.
  • Embedded Memory  Approximately 37.888 Mbits of on-chip RAM to support buffering, state storage, and embedded data structures.
  • I/O Capacity  600 user I/Os to support broad interfacing and high-pin-count system integration.
  • Power Supply  Core voltage supply specified from 820 mV to 880 mV for the FPGA core domain.
  • Package & Mounting  1152-FBGA (35×35) supplier device package; 1152-BBGA, FCBGA package case; surface-mount mounting type.
  • Operating Grade & Temperature  Commercial grade device specified for 0 °C to 85 °C operation.
  • Standards & Compliance  RoHS compliant.

Typical Applications

  • High-density digital systems  Use the 420,000 logic elements and large embedded memory to implement complex, programmable digital functions and custom logic.
  • High-pin-count interface designs  600 I/Os enable broad connectivity for multi-channel I/O, interconnect bridging, and board-level integration.
  • Platform and prototyping  The Stratix V GX device package and surface-mount form factor suit development of high-performance boards and evaluation platforms.

Unique Advantages

  • High logic density: 420,000 logic elements support large, feature-rich designs without immediate migration to larger device families.
  • Substantial on-chip memory: Approximately 37.888 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
  • Extensive I/O resources: 600 I/Os provide flexibility for complex signaling, multiple interfaces, and high channel counts.
  • Commercial-grade thermal range: Qualified for 0 °C to 85 °C operation for standard commercial applications.
  • Compact FBGA packaging: 1152-FBGA (35×35) enables a high-pin-count, surface-mount implementation for space-constrained PCBs.
  • Regulatory compliance: RoHS compliance supports environmentally conscious designs and manufacturing.

Why Choose 5SGXMA4K3F35C4WN?

The 5SGXMA4K3F35C4WN positions itself as a high-density, commercial-grade Stratix V GX FPGA option for designers needing substantial logic capacity, embedded memory, and large I/O counts in a compact FBGA package. Its specified supply voltage range and operating temperature provide clear electrical and environmental parameters for system design.

As part of the Stratix V device family, detailed electrical and switching characteristics are documented in the device datasheet, enabling thorough design planning and integration for long-term projects.

Request a quote or submit an inquiry for the 5SGXMA4K3F35C4WN to receive pricing and availability information tailored to your project needs.

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