5SGXMA4K3F35I3G

The 5SGXMA4K3F35I3G is a Stratix V GX field-programmable gate array (FPGA) IC designed for high-density, industrial-grade applications. It integrates 420,000 logic elements and approximately 37.9 Mbits of on-chip RAM with up to 600 user I/Os to support complex system integration and advanced programmable logic.

Built in a 1152-FBGA (35×35) surface-mount package and rated for industrial operation, the device is specified for a core supply range of 0.820 V to 0.880 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core & Logic  420,000 logic elements provide large programmable fabric for complex logic, control, and datapath implementations.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
• I/O Density  Up to 600 user I/Os to support broad peripheral and high-pin-count system interfaces.
• Power Supply Range  Core voltage specified from 820 mV to 880 mV to match system power-rail requirements.
• Package & Mounting  1152-BBGA / FCBGA package (supplier package: 1152-FBGA 35×35) in a surface-mount form factor for high-density PCB assembly.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C.
• Regulatory Compliance  RoHS compliant.
• Stratix V GX Family Characteristics  As a Stratix V GX device, this part belongs to a family offering multiple transceiver speed grades for high-speed serial interface applications (refer to the Stratix V device documentation for specific transceiver-grade details).

Typical Applications

• Industrial systems  Designs that require industrial temperature operation and high I/O density for control, monitoring, and automation subsystems.
• High-density logic integration  Implementations that need extensive programmable logic and on-chip RAM to consolidate multiple functions into a single FPGA.
• High-speed I/O and serial subsystems  Systems that leverage the GX family’s transceiver-grade capabilities together with a large number of user I/Os for connectivity and data movement.

Unique Advantages

• High logic capacity: 420,000 logic elements enable complex, integrated designs without excessive external logic.
• Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Large I/O complement: 600 user I/Os simplify interfacing to multiple peripherals, sensors, or daughter boards.
• Industrial-rated operation: Specified from −40 °C to 100 °C to meet the environmental needs of industrial deployments.
• Compact surface-mount package: 1152-FBGA (35×35) package offers a high-density footprint for space-constrained PCBs.
• RoHS compliance: Meets standard environmental directive requirements for electronics assemblies.

Why Choose 5SGXMA4K3F35I3G?

The 5SGXMA4K3F35I3G combines a large programmable fabric, significant embedded memory, and extensive I/O in an industrial-grade Stratix V GX FPGA. Its package and supply specifications make it suitable for compact, high-density designs that need robust operation across a wide temperature range.

This part is well suited for engineering teams building complex programmable systems that demand scalable logic resources, on-chip RAM capacity, and extensive connectivity while meeting industrial environmental requirements.

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