5SGXMA4K3F35I3N

The 5SGXMA4K3F35I3N is a Stratix V GX FPGA IC from Intel, delivering high digital integration with a large logic fabric and substantial on-chip memory. As a GX-class Stratix V device, it targets designs that require extensive logic resources, abundant I/O, and industrial-temperature operation.

Engineered for dense, high-channel-count implementations, this device combines 420,000 logic elements with approximately 37.9 Mbits of embedded memory and 600 I/O pins in a 1152-FBGA (35 × 35 mm) surface-mount package.

Key Features

• Logic Capacity  420,000 logic elements provide a large fabric for complex digital designs and system-level integration.
• On‑Chip Memory  Approximately 37.9 Mbits of embedded RAM enable memory-intensive algorithms and buffer storage without external RAM dependence.
• I/O Density  600 I/O pins support high channel counts and extensive peripheral interfacing for multi‑lane systems.
• Power Supply  Core voltage specified from 820 mV to 880 mV for compatibility with low-voltage core power domains.
• Package & Mounting  1152-FBGA (35×35 mm) FCBGA package designed for surface-mount PCB assembly, balancing density and thermal mass.
• Operating Range  Industrial-grade operation from –40 °C to 100 °C to support temperature-demanding deployments.
• Regulatory  RoHS-compliant construction meets common environmental directive requirements.

Typical Applications

• High-density digital systems  Large logic capacity and on‑chip memory make this device suitable for consolidating multiple IP blocks or subsystems into a single FPGA.
• High I/O interfacing  The 600-pin I/O count supports designs requiring extensive peripheral and bus connections.
• Memory-intensive algorithms  Approximately 37.9 Mbits of embedded RAM enable buffering, packet processing, and local data storage for compute-heavy tasks.
• Industrial deployments  Rated for –40 °C to 100 °C operation for use in environments where extended temperature tolerance is required.

Unique Advantages

• High integration density: 420,000 logic elements reduce the need for multiple devices, simplifying board design and lowering BOM complexity.
• Substantial on‑chip memory: Approximately 37.9 Mbits of embedded RAM minimizes external memory dependence and improves data locality.
• Extensive I/O resources: 600 I/O pins enable wide parallel interfaces and multi‑channel connectivity without excessive external multiplexing.
• Industrial temperature capability: Operation from –40 °C to 100 °C supports deployment in temperature-demanding applications.
• Compact FCBGA package: The 1152-FBGA (35 × 35 mm) package provides a balance of high pin count and manageable PCB footprint for dense system designs.
• RoHS compliance: Environmentally compliant manufacturing aligns with common sustainability and regulatory requirements.

Why Choose 5SGXMA4K3F35I3N?

The 5SGXMA4K3F35I3N positions itself as a high-capacity Stratix V GX FPGA option for engineers who need a large logic fabric, significant on‑chip memory, and a high I/O count in an industrial-temperature, surface-mount package. Its combination of 420,000 logic elements, approximately 37.9 Mbits of embedded RAM, and 600 I/Os makes it suitable for consolidating complex digital functions and interfacing dense system architectures.

Designed for projects that demand scalability and robust operation across temperature extremes, this Intel Stratix V GX device offers a platform for long-term designs where integration, memory capacity, and I/O flexibility are primary considerations.

If you need pricing, availability, or a formal quote for 5SGXMA4K3F35I3N, submit a request or inquiry to obtain further purchasing information and lead-time details.