5SGXMA4K3F35I4N

The 5SGXMA4K3F35I4N is a Stratix V GX Field Programmable Gate Array (FPGA) IC offered in an industrial temperature grade. It provides a high-density programmable fabric with extensive on-chip memory and large I/O capacity suitable for designs that require substantial logic resources, embedded memory, and broad I/O connectivity.

Built in a 1152-ball FCBGA package with a 35 × 35 mm footprint, this device combines a large number of logic elements and significant embedded RAM with an industrial operating temperature range and a low core-voltage supply window for power-sensitive applications.

Key Features

• High-density logic — 420,000 logic elements provide a large programmable fabric for complex digital designs and system-level integration.
• Embedded memory — Approximately 38 Mbits of on-chip RAM to implement FIFOs, buffers, and local data storage without external memory.
• Extensive I/O — 600 user I/O pins to support wide parallel interfaces and numerous peripheral connections.
• Package — 1152-BBGA (FCBGA) in a 1152-FBGA (35 × 35) supplier package, enabling high pin-count integration in a compact form factor.
• Power supply — Core supply voltage range of 820 mV to 880 mV to support the device’s core operating requirements.
• Temperature and grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Mounting — Surface-mount device suitable for standard PCB assembly processes.
• Family transceiver capability — Part of the Stratix V GX family; family documentation lists GX transceiver speed grades (series-level details include supported channel rates up to the family-defined grades).

Typical Applications

• High-performance digital processing — Large logic capacity and extensive embedded RAM make the device suitable for complex signal processing and algorithm acceleration.
• High-density I/O systems — 600 I/Os support wide data buses, sensor arrays, and extensive peripheral interfacing.
• Industrial control and communication — Industrial temperature grade and robust package support deployment in industrial automation and communications equipment.

Unique Advantages

• Large programmable fabric: 420,000 logic elements reduce the need for multiple devices, simplifying board-level design and lowering part counts.
• Significant on-chip memory: Approximately 38 Mbits of embedded RAM enables local buffering and state storage without adding external memory components.
• High I/O capacity: 600 I/O pins provide flexibility to connect many peripherals or implement wide parallel interfaces directly on-chip.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging deployments.
• Compact high-pin package: 1152-ball FCBGA (35 × 35 mm) offers a high pin-count solution in a manageable footprint for system integration.
• Controlled core supply: Defined core voltage range (820–880 mV) supports predictable power design and board-level power provisioning.

Why Choose 5SGXMA4K3F35I4N?

The 5SGXMA4K3F35I4N positions itself where high-density logic, substantial embedded memory, and broad I/O are required in an industrial-grade FPGA. Its combination of 420,000 logic elements, approximately 38 Mbits of on-chip RAM, and 600 I/Os makes it well suited to system designs that consolidate multiple functions into a single programmable device while maintaining deployment-ready thermal margins.

Designers seeking scalability and integration benefit from the Stratix V GX family’s documented transceiver grade options and the reliable FCBGA package format, enabling robust, long-term implementations supported by family-level documentation.

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