5SGXMA4K3F40C2G

The 5SGXMA4K3F40C2G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a commercial temperature grade. It delivers very high logic capacity and on‑chip memory combined with a large I/O complement in a 1517‑ball FCBGA package, suited for high‑density programmable designs that require extensive embedded resources and I/O connectivity.

Datasheet documentation for the Stratix V family describes the device electrical and switching characteristics, including core and periphery performance and I/O timing, which applies to devices in this family.

Key Features

• High logic density  Approximately 420,000 logic elements (logic element cells) to implement large, complex programmable logic designs.
• Significant embedded memory  Approximately 37.9 Mbits of on‑chip RAM for large buffers, state storage, and temporary data structures.
• Extensive I/O  Up to 600 I/O pins to support wide parallel interfaces and multiple high‑pincount connections.
• Low‑voltage core  Core supply voltage specified from 0.870 V to 0.930 V, enabling designs targeting the Stratix V core operating range.
• Commercial temperature grade  Specified to operate from 0 °C to 85 °C for standard commercial deployments.
• Packaging and mounting  1517‑BBGA FCBGA package (supplier device package: 1517‑FBGA, 40×40) with surface‑mount mounting for compact board integration.
• Regulatory compliance  RoHS compliant to meet common environmental requirements.

Typical Applications

• High‑density programmable logic  Large FPGA implementations that require hundreds of thousands of logic elements and substantial on‑chip RAM.
• Multi‑I/O systems  Designs needing a broad set of parallel or multiplexed interfaces supported by up to 600 I/Os.
• Embedded acceleration  Hardware acceleration functions that benefit from large embedded memory and high logic capacity within a single device.

Unique Advantages

• Substantial logic capacity: Approximately 420,000 logic elements reduce the need for multiple FPGAs or external glue logic.
• Large on‑chip RAM: About 37.9 Mbits of embedded memory enables sizable data buffering and state storage on the device.
• High I/O count: 600 I/Os provide flexibility for wide buses, multiple peripherals, and complex system interconnects.
• Compact FCBGA packaging: 1517‑ball FCBGA (40×40) provides a dense footprint for space‑constrained board layouts while supporting surface‑mount assembly.
• Commercial operating range: Rated 0 °C to 85 °C for standard commercial deployments where that temperature range is required.
• RoHS compliant: Meets commonly required environmental compliance for modern electronics manufacturing.

Why Choose 5SGXMA4K3F40C2G?

The 5SGXMA4K3F40C2G combines very high logic capacity, significant embedded memory, and a large I/O complement in a compact FCBGA package—making it a practical option for designs that require consolidated programmable logic and on‑chip resources. Its commercial grade and defined core voltage range align it with standard embedded and system designs that target the Stratix V family.

Designed and documented as part of the Stratix V series, this device is appropriate for customers seeking a high‑capacity FPGA solution backed by available device electrical and switching characteristic documentation.

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