5SGXMA4K3F35I3WN

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 730 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4K3F35I3WN – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 420,000 logic elements

The 5SGXMA4K3F35I3WN is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel. It provides 420,000 logic elements and approximately 37.9 Mbits of embedded memory, with 600 user I/O pins for dense, highly connected designs.

Packaged in a 1152-FBGA (35×35) surface-mount package and rated for industrial operation from −40 °C to 100 °C, the device operates from a core supply range of 820 mV to 880 mV and is RoHS compliant.

Key Features

  • Logic Capacity 420,000 logic elements to implement large, complex programmable logic designs.
  • Embedded Memory Approximately 37.9 Mbits of on-chip RAM for buffering, state storage, and memory-intensive functions.
  • I/O Density 600 user I/O pins to support extensive peripheral interfacing and high channel counts.
  • Package & Mounting 1152-BBGA (FCBGA) / 1152-FBGA (35×35) surface-mount package for compact, board-level integration.
  • Power Supply Core voltage supply range of 820 mV to 880 mV to meet device operating requirements.
  • Temperature & Grade Industrial temperature grade with an operating range of −40 °C to 100 °C for extended-environment applications.
  • Standards Compliance RoHS compliant to support regulatory requirements for lead-free manufacturing.

Unique Advantages

  • High logic density: 420,000 logic elements enable complex logic implementations without external programmable logic expansion.
  • Significant on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory for many designs.
  • Extensive I/O connectivity: 600 I/O pins accommodate rich peripheral interfaces and high channel counts directly on the FPGA.
  • Industrial temperature rating: −40 °C to 100 °C supports deployment in thermally demanding environments.
  • Compact FBGA package: 1152-ball FBGA (35×35) allows high-density board layouts while maintaining surface-mount assembly compatibility.
  • Vendor-backed documentation: Device is part of the Stratix V family with published electrical and switching characteristics in the official device datasheet.

Why Choose 5SGXMA4K3F35I3WN?

The 5SGXMA4K3F35I3WN combines high logic element count, substantial embedded memory, and a large number of I/Os in a compact 1152-FBGA surface-mount package. Its industrial temperature grade and defined core voltage range make it suitable for robust, high-density programmable logic designs that require on-chip resources and extensive I/O.

As a member of the Intel Stratix V GX family, this device is supported by detailed device documentation covering electrical and switching characteristics, enabling designers to plan power, thermal, and I/O integration with confidence.

Request a quote or submit a product inquiry to initiate procurement or to obtain additional ordering and availability information.

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