5SGXMA4K3F35I3WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 730 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4K3F35I3WN – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 420,000 logic elements
The 5SGXMA4K3F35I3WN is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel. It provides 420,000 logic elements and approximately 37.9 Mbits of embedded memory, with 600 user I/O pins for dense, highly connected designs.
Packaged in a 1152-FBGA (35×35) surface-mount package and rated for industrial operation from −40 °C to 100 °C, the device operates from a core supply range of 820 mV to 880 mV and is RoHS compliant.
Key Features
- Logic Capacity 420,000 logic elements to implement large, complex programmable logic designs.
- Embedded Memory Approximately 37.9 Mbits of on-chip RAM for buffering, state storage, and memory-intensive functions.
- I/O Density 600 user I/O pins to support extensive peripheral interfacing and high channel counts.
- Package & Mounting 1152-BBGA (FCBGA) / 1152-FBGA (35×35) surface-mount package for compact, board-level integration.
- Power Supply Core voltage supply range of 820 mV to 880 mV to meet device operating requirements.
- Temperature & Grade Industrial temperature grade with an operating range of −40 °C to 100 °C for extended-environment applications.
- Standards Compliance RoHS compliant to support regulatory requirements for lead-free manufacturing.
Unique Advantages
- High logic density: 420,000 logic elements enable complex logic implementations without external programmable logic expansion.
- Significant on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory for many designs.
- Extensive I/O connectivity: 600 I/O pins accommodate rich peripheral interfaces and high channel counts directly on the FPGA.
- Industrial temperature rating: −40 °C to 100 °C supports deployment in thermally demanding environments.
- Compact FBGA package: 1152-ball FBGA (35×35) allows high-density board layouts while maintaining surface-mount assembly compatibility.
- Vendor-backed documentation: Device is part of the Stratix V family with published electrical and switching characteristics in the official device datasheet.
Why Choose 5SGXMA4K3F35I3WN?
The 5SGXMA4K3F35I3WN combines high logic element count, substantial embedded memory, and a large number of I/Os in a compact 1152-FBGA surface-mount package. Its industrial temperature grade and defined core voltage range make it suitable for robust, high-density programmable logic designs that require on-chip resources and extensive I/O.
As a member of the Intel Stratix V GX family, this device is supported by detailed device documentation covering electrical and switching characteristics, enabling designers to plan power, thermal, and I/O integration with confidence.
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