5SGXMA4K3F35I3LN

The 5SGXMA4K3F35I3LN is an Intel Stratix V GX field-programmable gate array (FPGA) supplied in a 1152-BBGA FCBGA package. It delivers very high logic density combined with substantial embedded RAM and a large I/O count, making it suitable for demanding, industrial-temperature designs.

Built on the Stratix V GX device family, this part targets applications that require high-density programmable logic, extensive embedded memory, and advanced I/O and transceiver characteristics documented in the Stratix V device datasheet.

Key Features

• Core density  Approximately 420,000 logic elements for complex programmable logic and large-scale integration.
• Embedded memory  Approximately 37.9 Mbits of on-chip RAM (total RAM bits: 37,888,000) to reduce external memory dependency.
• I/O capacity  600 general-purpose I/Os to support multiple interfaces and parallel connections.
• Package & mounting  1152-BBGA (1152-FBGA, 35×35) FCBGA package; surface-mount assembly.
• Power requirements  Core voltage supply specified at 820 mV to 880 mV.
• Temperature & grade  Industrial grade operation from –40 °C to 100 °C.
• Electrical and I/O characteristics  Device family documentation covers switching characteristics, transceiver specifications, and programmable I/O timing for system-level design.
• Compliance  RoHS-compliant.

Typical Applications

• High-performance signal processing  Large logic capacity and substantial on-chip RAM support complex DSP algorithms and custom acceleration functions.
• Networking and connectivity equipment  High I/O count and Stratix V GX transceiver/I/O capabilities make the device suitable for systems requiring extensive serial links and interface density.
• Industrial control and automation  Industrial temperature rating (–40 °C to 100 °C) and robust package options are suited for deployed control systems and factory equipment.
• Custom compute and prototyping  High logic density in a compact FCBGA package enables dense, reconfigurable prototypes and production designs.

Unique Advantages

• High integration density: 420,000 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level partitioning.
• Large on-chip memory: Approximately 37.9 Mbits of embedded RAM helps minimize external memory requirements and lowers system BOM complexity.
• Extensive I/O resources: 600 I/Os provide flexibility for multiple interfaces, wide data buses, and parallel connectivity.
• Industrial reliability: Specified for –40 °C to 100 °C operation and offered in an industrial grade to meet demanding environmental requirements.
• Compact, surface-mount package: 1152-FBGA (35×35) FCBGA supports high-density PCB layouts while providing robust mechanical and thermal characteristics.
• Low-voltage core operation: Core supply range of 820 mV–880 mV aligns with modern low-voltage system power architectures.

Why Choose 5SGXMA4K3F35I3LN?

The 5SGXMA4K3F35I3LN places high logic density, sizeable embedded memory, and a large I/O complement into a single Stratix V GX FCBGA package rated for industrial operation. It is positioned for system designers and engineers who need a scalable, high-capacity programmable device with documented electrical, switching, and transceiver characteristics from the Stratix V family.

For designs that require consolidation of complex functions, support for extensive I/O, and reliable operation across a wide temperature range, this device provides a documented platform to implement high-density, performance-focused FPGA solutions.

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