5SGXMA4K3F35I3
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 434 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4K3F35I3 – Stratix® V GX FPGA, 420,000 logic elements, 600 I/Os, 1152‑BBGA
The 5SGXMA4K3F35I3 is a Stratix V GX field programmable gate array (FPGA) in an industrial-grade offering. It provides a high-density programmable fabric with 420,000 logic elements and approximately 37.9 Mbits of embedded RAM, targeted at designs that require large programmable logic capacity, abundant on-chip memory, and high I/O integration.
Packaged in a 1152‑BBGA (35×35 FCBGA) and rated for surface-mount assembly, this device supports a broad operating range and is RoHS compliant, making it suitable for engineered systems requiring long-term availability and environmental compliance.
Key Features
- High Logic Capacity 420,000 logic elements to implement complex digital functions and large-scale custom logic.
- Embedded Memory Approximately 37.9 Mbits of on-chip RAM for buffering, lookup tables, and state storage without external memory.
- Abundant I/O 600 I/Os to support dense external connectivity and multi-channel interfacing directly from the FPGA.
- Package and Mounting 1152‑BBGA (FCBGA) supplier package (1152‑FBGA, 35×35) designed for surface-mount assembly in compact system footprints.
- Voltage Supply Core supply range of 820 mV to 880 mV, allowing precise power sequencing and core voltage planning.
- Industrial Temperature Range Rated operating temperature from −40 °C to 100 °C for robust performance in industrial environments.
- Series-Level Transceiver Capability As part of the Stratix V GX family, series documentation indicates GX transceiver options are supported at multiple speed grades (series-level capability).
- Standards Compliance RoHS compliant for environmental regulatory alignment.
Typical Applications
- High‑density Signal Processing Implement large FPGA-based datapaths, DSP pipelines, and custom accelerators using the device's extensive logic resources and embedded RAM.
- Networking and Communications Leverage high I/O count and Stratix V GX family transceiver capabilities for multi‑port packet processing, protocol bridging, and high-speed interfaces (series-level).
- Data Center and Compute Acceleration Use the large logic and memory resources for hardware acceleration, packet inspection, and offload functions in server and appliance environments.
- Industrial Control and Instrumentation Industrial temperature rating and broad I/O support make the device suitable for complex control logic, real-time monitoring, and test systems.
Unique Advantages
- Scalable Logic Density: 420,000 logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing board-level complexity.
- On‑chip Memory for Reduced BOM: Approximately 37.9 Mbits of embedded RAM minimizes the need for external memory components, simplifying system design.
- High I/O Integration: 600 I/Os enable direct connection to many peripherals and interfaces, lowering the need for external multiplexers or I/O expanders.
- Industrial Operating Range: Rated from −40 °C to 100 °C to support reliable operation in temperature-challenging deployments.
- Compact, Surface‑Mount Packaging: 1152‑BBGA (35×35) FCBGA package balances pin count and board area for dense, manufacturable designs.
- Regulatory Readiness: RoHS compliance supports deployment in environmentally regulated markets.
Why Choose 5SGXMA4K3F35I3?
The 5SGXMA4K3F35I3 positions itself as a high-capacity, industrial-grade FPGA platform for engineers building complex, I/O‑intensive systems. Its combination of 420,000 logic elements, substantial embedded RAM, and 600 I/Os enables consolidation of multi-function designs onto a single device, reducing system BOM and simplifying board layout.
Built on the Stratix V GX family architecture and supplied in a 1152‑BBGA surface-mount package, this device is suited to teams that require long-term availability, series-level transceiver capability, and industrial temperature performance. It offers a clear upgrade path and scalability for designs that need significant programmable resources and robust operational margins.
Request a quote or submit an inquiry to get pricing, availability, and lead-time details for the 5SGXMA4K3F35I3. Technical and procurement teams can use this information to evaluate fit for upcoming designs or volume production.

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