5SGXMA4K3F35C4N

The 5SGXMA4K3F35C4N is an Intel Stratix® V GX field-programmable gate array (FPGA) supplied in a 1152-ball BGA package. It delivers large programmable logic capacity, substantial on-chip memory, and a high I/O count for designs that require dense logic integration and extensive external interfacing.

Key differentiators are its 420,000 logic elements, approximately 37.9 Mbits of embedded RAM, and support for 600 I/Os, combined with a low-voltage core supply range (820 mV–880 mV) and commercial temperature rating (0 °C to 85 °C).

Key Features

• Logic Capacity  Provides 420,000 logic elements to implement large custom digital designs and complex finite-state machines.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM for buffering, LUT-based storage, and memory-intensive logic functions.
• I/O Resources  Up to 600 user I/Os to support broad external interfacing and parallel connectivity requirements.
• Power and Core Supply  Core voltage range of 820 mV to 880 mV to support targeted system power-rail designs.
• Package and Mounting  1152-ball BGA (FCBGA) package; supplier device package listed as 1152-FBGA (35 × 35 mm). Surface-mount mounting type simplifies board-level assembly for modern PCB processes.
• Operating Range  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• High-density digital processing  Implement large combinational and sequential logic blocks where extensive programmable fabric and on-chip RAM are required.
• High I/O interface systems  Drive designs that need many parallel or multiplexed external interfaces using the FPGA’s 600 available I/Os.
• Custom accelerators and prototyping  Use the device as a platform for hardware acceleration or complex system prototyping that benefits from large logic and memory resources.

Unique Advantages

• Highly integrated logic and memory: 420,000 logic elements combined with approximately 37.9 Mbits of RAM reduce the need for external logic and memory devices.
• Extensive I/O capacity: 600 I/Os simplify integration with multiple peripherals, high-channel-count interfaces, and wide parallel buses.
• Compact BGA package: 1152-ball FCBGA (35 × 35 mm) delivers high pin count in a compact footprint for space-constrained PCBs.
• Low-voltage core operation: 820 mV–880 mV supply range aligns with modern low-voltage power architectures.
• Commercial temperature suitability: Rated for 0 °C to 85 °C environments typical of many embedded and enterprise applications.
• RoHS compliant: Supports lead-free manufacturing requirements for global production.

Why Choose 5SGXMA4K3F35C4N?

The 5SGXMA4K3F35C4N positions itself as a high-capacity Stratix V GX FPGA option for designs that require significant programmable logic, large embedded memory, and a high number of I/Os in a single device. Its combination of 420,000 logic elements, approximately 37.9 Mbits of on-chip RAM, and 600 I/Os makes it suitable for demanding digital integration tasks where consolidating functionality on-chip reduces board-level complexity.

This commercial-grade device provides predictable operating parameters (820 mV–880 mV core supply and 0 °C–85 °C temperature range) and RoHS compliance, supporting production-ready designs that rely on a robust programmable fabric and extensive I/O capability.

Request a quote or submit a procurement inquiry today to obtain pricing, availability, and delivery options for 5SGXMA4K3F35C4N.