5SGXMA4K3F35C3G

The 5SGXMA4K3F35C3G is a Stratix® V GX FPGA from Intel, delivered in a 1152-ball FCBGA package (1152-FBGA, 35×35). It provides a high level of on-chip logic and memory resources with a comprehensive set of I/O for complex digital designs.

This commercial-grade device is suited to applications that require large logic capacity, substantial embedded RAM, and extensive I/O connectivity while operating within a 0 °C to 85 °C range and a core voltage supply of 0.820–0.880 V. The device is RoHS compliant.

Key Features

• Logic Capacity — 420,000 logic elements for implementing large-scale digital systems and custom accelerators.
• Logic Blocks — 158,500 logic blocks providing the structural resources used to build combinational and sequential logic.
• Embedded Memory — Approximately 37.9 Mbits of embedded memory for on-chip data buffering, FIFOs, and tables.
• I/O Count — 600 user I/O pins enabling wide parallel interfaces and complex board-level connectivity.
• Power and Supply — Core supply range from 0.820 V to 0.880 V for controlled power-domain design.
• Package and Mounting — 1152-BBGA FCBGA package (1152-FBGA, 35×35) designed for surface-mount board assembly.
• Operating Environment — Commercial temperature grade with specified operation from 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital processing — Use the large logic and embedded memory capacity to implement data-paths, packet processing, or custom compute blocks.
• Multi‑interface systems — 600 I/O pins support integration of multiple parallel and serial interfaces on a single device.
• Prototyping and system integration — Commercial designs requiring substantial programmable logic and flexible I/O for system-level validation and integration.

Unique Advantages

• High logic density: 420,000 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
• Substantial embedded memory: Approximately 37.9 Mbits of on-chip RAM helps minimize external memory dependence and improves data-path latency.
• Extensive I/O resources: 600 I/O pins provide the flexibility to connect multiple peripherals, interfaces, and daughter cards without additional bridging devices.
• Industry-standard BGA package: 1152-ball FCBGA (35×35) supports high pin-count routing and reliable surface-mount assembly.
• Commercial temperature grade: Specified operation from 0 °C to 85 °C for mainstream electronics and embedded applications.
• RoHS compliance: Meets environmental compliance requirements for lead-free assembly and deployment.

Why Choose 5SGXMA4K3F35C3G?

The 5SGXMA4K3F35C3G positions itself as a high-capacity Stratix V GX FPGA option for commercial designs that require a combination of large logic resources, considerable embedded memory, and broad I/O connectivity. Its 1152-ball FCBGA package supports dense board-level integration while the specified core voltage range and commercial temperature grade align with mainstream production environments.

Designers and system integrators seeking to consolidate complex digital functions and reduce component count will find the device’s logic density, embedded RAM, and I/O complement well suited to demanding FPGA-based designs. RoHS compliance and standard surface-mount packaging support contemporary manufacturing flows.

Request a quote or submit a pricing inquiry to evaluate 5SGXMA4K3F35C3G for your next design and to confirm availability and lead-time for production planning.