5SGXMA4K3F35I4G

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 531 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4K3F35I4G – Stratix V GX FPGA, 420,000 logic elements, 600 I/Os, 1152-FBGA (35×35)

The 5SGXMA4K3F35I4G is a Stratix® V GX field programmable gate array (FPGA) offered in an industrial temperature grade. This high-density FPGA integrates a large logic fabric, substantial on-chip memory, and extensive I/O capability to address complex, high-performance system designs.

Its combination of approximately 420,000 logic elements, roughly 38 Mbits of embedded memory, and up to 600 I/O pins makes it suitable for applications that require large programmable logic capacity, significant embedded storage, and dense external connectivity.

Key Features

  • Core Logic  Approximately 420,000 logic elements provide substantial programmable logic resources for complex digital designs.
  • Embedded Memory  Approximately 38 Mbits of on-chip RAM to support large buffers, state storage, and memory-intensive logic functions.
  • I/O Capacity  Up to 600 general-purpose I/O pins to support dense connectivity and wide parallel interfaces.
  • Power Supply  Voltage supply range specified at 820 mV to 880 mV, enabling integration into systems designed around this core voltage window.
  • Package & Mounting  1152-ball FCBGA / BBGA package (supplier device package: 1152-FBGA (35×35)) with surface-mount mounting for high-density board integration.
  • Temperature & Grade  Industrial temperature grade with an operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Compliance  RoHS compliant, meeting common regulatory requirements for lead-free assembly.
  • Family-level Transceiver Capability (datasheet)  Stratix V GX family transceiver speed grades are documented in the device datasheet and include channel rates referenced up to 14.1 Gbps (family-level information).

Typical Applications

  • High-density I/O systems  Designs that require large numbers of external interfaces can take advantage of the FPGA’s up to 600 I/O pins for parallel and high-channel-count connections.
  • Memory-intensive logic  Applications needing substantial on-chip buffering or data staging benefit from approximately 38 Mbits of embedded RAM.
  • Complex programmable logic  Systems implementing large custom processing, protocol engines, or control logic can leverage the approximately 420,000 logic elements.
  • Industrial equipment  The industrial temperature rating (−40 °C to 100 °C) supports deployment in industrial control, instrumentation, and factory automation environments.

Unique Advantages

  • High logic density: Approximately 420,000 logic elements enable consolidation of complex functions into a single programmable device, reducing system BOM complexity.
  • Substantial embedded memory: Approximately 38 Mbits of on-chip RAM lowers reliance on external memory for many buffering and state-storage needs.
  • Extensive external connectivity: Up to 600 I/Os provide the flexibility to interface with multiple peripherals, sensors, and parallel data buses without multiplexing compromises.
  • Industrial-grade operation: Rated for −40 °C to 100 °C, the device is suited for environments that demand broader temperature tolerance.
  • Board-level integration: 1152-ball FCBGA/BBGA surface-mount packaging supports compact, high-density PCB layouts for space-constrained designs.
  • Regulatory alignment: RoHS compliance simplifies lead-free manufacturing and environmental compliance efforts.

Why Choose 5SGXMA4K3F35I4G?

The 5SGXMA4K3F35I4G delivers a combination of high logic capacity, significant embedded memory, and broad I/O resources in an industrial-temperature Stratix V GX device. This balance of integration and density is well-suited for engineers building complex digital systems that require large programmable fabrics and on-chip storage while maintaining industrial operating margins.

Choosing this part enables consolidation of multiple functions into a single FPGA, streamlining board design and reducing external component count. The device’s documented family-level transceiver capabilities and the detailed electrical characteristics in the Stratix V datasheet provide a transparent basis for system-level planning and integration.

Request a quote or submit a purchase inquiry to receive pricing and lead-time information for 5SGXMA4K3F35I4G.

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