5SGXMA4K3F35I4G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 531 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4K3F35I4G – Stratix V GX FPGA, 420,000 logic elements, 600 I/Os, 1152-FBGA (35×35)
The 5SGXMA4K3F35I4G is a Stratix® V GX field programmable gate array (FPGA) offered in an industrial temperature grade. This high-density FPGA integrates a large logic fabric, substantial on-chip memory, and extensive I/O capability to address complex, high-performance system designs.
Its combination of approximately 420,000 logic elements, roughly 38 Mbits of embedded memory, and up to 600 I/O pins makes it suitable for applications that require large programmable logic capacity, significant embedded storage, and dense external connectivity.
Key Features
- Core Logic Approximately 420,000 logic elements provide substantial programmable logic resources for complex digital designs.
- Embedded Memory Approximately 38 Mbits of on-chip RAM to support large buffers, state storage, and memory-intensive logic functions.
- I/O Capacity Up to 600 general-purpose I/O pins to support dense connectivity and wide parallel interfaces.
- Power Supply Voltage supply range specified at 820 mV to 880 mV, enabling integration into systems designed around this core voltage window.
- Package & Mounting 1152-ball FCBGA / BBGA package (supplier device package: 1152-FBGA (35×35)) with surface-mount mounting for high-density board integration.
- Temperature & Grade Industrial temperature grade with an operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Compliance RoHS compliant, meeting common regulatory requirements for lead-free assembly.
- Family-level Transceiver Capability (datasheet) Stratix V GX family transceiver speed grades are documented in the device datasheet and include channel rates referenced up to 14.1 Gbps (family-level information).
Typical Applications
- High-density I/O systems Designs that require large numbers of external interfaces can take advantage of the FPGA’s up to 600 I/O pins for parallel and high-channel-count connections.
- Memory-intensive logic Applications needing substantial on-chip buffering or data staging benefit from approximately 38 Mbits of embedded RAM.
- Complex programmable logic Systems implementing large custom processing, protocol engines, or control logic can leverage the approximately 420,000 logic elements.
- Industrial equipment The industrial temperature rating (−40 °C to 100 °C) supports deployment in industrial control, instrumentation, and factory automation environments.
Unique Advantages
- High logic density: Approximately 420,000 logic elements enable consolidation of complex functions into a single programmable device, reducing system BOM complexity.
- Substantial embedded memory: Approximately 38 Mbits of on-chip RAM lowers reliance on external memory for many buffering and state-storage needs.
- Extensive external connectivity: Up to 600 I/Os provide the flexibility to interface with multiple peripherals, sensors, and parallel data buses without multiplexing compromises.
- Industrial-grade operation: Rated for −40 °C to 100 °C, the device is suited for environments that demand broader temperature tolerance.
- Board-level integration: 1152-ball FCBGA/BBGA surface-mount packaging supports compact, high-density PCB layouts for space-constrained designs.
- Regulatory alignment: RoHS compliance simplifies lead-free manufacturing and environmental compliance efforts.
Why Choose 5SGXMA4K3F35I4G?
The 5SGXMA4K3F35I4G delivers a combination of high logic capacity, significant embedded memory, and broad I/O resources in an industrial-temperature Stratix V GX device. This balance of integration and density is well-suited for engineers building complex digital systems that require large programmable fabrics and on-chip storage while maintaining industrial operating margins.
Choosing this part enables consolidation of multiple functions into a single FPGA, streamlining board design and reducing external component count. The device’s documented family-level transceiver capabilities and the detailed electrical characteristics in the Stratix V datasheet provide a transparent basis for system-level planning and integration.
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