5SGXMA4K3F35I4WN

The 5SGXMA4K3F35I4WN is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1152‑ball BGA package designed for high‑density digital designs. It provides a large programmable fabric with 420,000 logic elements and approximately 37.9 Mbits of embedded memory to implement complex custom logic and data buffering on a single device.

Targeted at industrial-grade systems, this surface-mount FPGA offers broad I/O connectivity with 600 I/Os and supports operation across a wide supply and temperature range for deployment in demanding environments.

Key Features

• Core Capacity — 420,000 logic elements for implementing large-scale digital designs and complex custom accelerators.
• Embedded Memory — Approximately 37.9 Mbits of on‑chip RAM for buffering, state storage, and memory‑intensive logic.
• I/O Density — 600 I/O pins to support wide parallel interfacing and high pin‑count system integration.
• Package & Mounting — 1152‑BBGA (FCBGA) / 1152‑FBGA (35×35) supplier device package in a surface‑mount form factor for standard PCB assembly.
• Power Supply Range — Core voltage supply specified from 820 mV to 880 mV, enabling precise power management in system designs.
• Industrial Temperature Grade — Qualified for operation from −40 °C to 100 °C for industrial environment compatibility.
• Regulatory — RoHS compliant.

Typical Applications

• High‑density digital processing — Implement large, custom digital logic and hardware acceleration using 420,000 logic elements and abundant embedded RAM.
• I/O‑intensive systems — Leverage 600 I/Os to connect multiple parallel interfaces, sensors, or external memory devices without extensive external glue logic.
• Industrial control and instrumentation — Industrial temperature rating (−40 °C to 100 °C) and robust supply specifications support deployment in factory and instrumentation equipment.
• Platform consolidation — Combine multiple functions on a single FPGA fabric to reduce overall system BOM and streamline board layout using the device’s high integration.

Unique Advantages

• High integration density: 420,000 logic elements and ~37.9 Mbits of embedded RAM enable consolidation of complex functions on a single device, reducing system component count.
• Extensive I/O capability: 600 I/Os simplify interfacing to high‑pin‑count systems and minimize the need for external multiplexing or expansion logic.
• Industrial readiness: Specified for −40 °C to 100 °C operation to meet thermal requirements of industrial applications.
• Standard assembly footprint: 1152‑ball FBGA package (35×35) and surface‑mount mounting allow integration into standard PCB assembly flows.
• Controlled core supply range: 820–880 mV supply specification supports predictable power design and core voltage management.
• RoHS compliance: Environmentally compliant for regions and programs that require RoHS‑conforming components.

Why Choose 5SGXMA4K3F35I4WN?

The 5SGXMA4K3F35I4WN combines large programmable capacity, substantial embedded memory, and a high I/O count in an industrial‑grade package suitable for demanding designs. Its surface‑mount 1152‑FBGA package and controlled core supply make it straightforward to integrate into production PCB assemblies while meeting industrial thermal requirements.

This device is well suited for engineering teams building high‑density, I/O‑heavy systems that benefit from on‑chip RAM and extensive logic resources, offering a scalable platform for consolidating multiple functions and simplifying system architecture.

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