5SGXMA4K3F40C3G

The 5SGXMA4K3F40C3G is a Stratix V GX family FPGA from Intel, delivering high-density programmable logic in a 1517-ball BGA (FCBGA) package. It combines substantial logic capacity, embedded memory, and a large I/O count for complex digital designs that require integration of logic, memory, and connectivity.

Designed as a commercial-grade device and documented in the Stratix V device datasheet, this part is targeted at applications that need extensive on-chip resources and high pin count while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Core logic capacity — 420,000 logic elements for implementing large-scale, high-density logic designs.
• Embedded memory — Approximately 37.9 Mbits of on-chip RAM to support data buffering, signal processing, and state storage without external memory in many use cases.
• High I/O count — 600 I/O pins to support wide parallel interfaces, complex board-level integration, and extensive peripheral connectivity.
• Package & mounting — 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40); surface-mount mounting for modern PCB assembly.
• Core voltage — Low-voltage core operation specified between 820 mV and 880 mV for the device core supply.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C, suitable for commercial applications.
• Standards compliance — RoHS-compliant device, meeting common environmental restrictions for assembly and deployment.
• Documented electrical and switching characteristics — Stratix V device datasheet provides detailed electrical, switching, and I/O timing specifications for design and validation.

Typical Applications

• High-density programmable logic systems — Implement complex logic functions and large state machines using the 420,000 logic elements.
• Memory-centric designs — Use approximately 37.9 Mbits of embedded RAM for buffering, FIFOs, and on-chip data storage to minimize external memory needs.
• High-pin-count interfacing — Leverage 600 I/Os for multi-channel interfaces, wide data buses, and rich peripheral integration.
• Commercial embedded platforms — Suitable for commercial temperature-range products requiring high integration in a compact FCBGA package.

Unique Advantages

• Large logic fabric — 420,000 logic elements enable designs with significant logic complexity without immediate need to partition across multiple devices.
• Ample on-chip RAM — Approximately 37.9 Mbits of embedded memory reduces reliance on external DRAM for many buffering and DSP tasks.
• Extensive I/O — 600 I/O pins provide flexibility for high-throughput data paths and multiple peripheral connections on a single device.
• Compact FCBGA package — 1517-ball BGA (40×40) balances high integration density with board-space efficiency for compact system designs.
• Low-voltage core operation — 0.82–0.88 V core supply supports designs optimized for low-power core operation.
• Commercial-grade and RoHS compliant — Clear commercial temperature rating and environmental compliance for mainstream product deployments.

Why Choose 5SGXMA4K3F40C3G?

This Stratix V GX FPGA is positioned for designs that require large-scale programmable logic, significant embedded memory, and a high I/O count within a commercial temperature envelope. Its combination of 420,000 logic elements, roughly 37.9 Mbits of on-chip RAM, and 600 I/Os supports high-integration designs where board-level complexity and external component count must be minimized.

Backed by Intel's Stratix V device documentation and electrical/switching characterization, the 5SGXMA4K3F40C3G is suitable for engineering teams building advanced commercial systems that demand predictable electrical behavior and extensive on-chip resources.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXMA4K3F40C3G.