5SGXMA4K3F40C3N

The 5SGXMA4K3F40C3N is an Intel Stratix V GX FPGA in a 1517-BBGA FCBGA surface-mount package. This commercial-grade device provides high logic density and substantial on-chip RAM for complex programmable-logic implementations in commercial electronic systems.

Key device characteristics include 420,000 logic elements, approximately 38 Mbits of embedded memory (37,888,000 total RAM bits), 600 I/O pins, and a core supply voltage range of 820 mV to 880 mV. The device is rated for operation from 0 °C to 85 °C and is RoHS compliant.

Key Features

• Core logic — 420,000 logic elements for large-scale digital integration and complex logic implementation.
• Embedded memory — Approximately 38 Mbits of on-chip RAM (37,888,000 bits) to support buffering, lookup tables, and state storage within the device.
• I/O capacity — 600 available I/O pins to handle extensive external interfacing and parallel data paths.
• Package & mounting — 1517-BBGA, FCBGA package; supplier device package 1517-FBGA (40×40); surface-mount for PCB integration.
• Power — Core voltage supply range of 820 mV to 880 mV to match low-voltage system designs.
• Temperature & grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards compliance — RoHS compliant.
• Series documentation — Electrical and switching characteristics, I/O timing, and programmable I/O element details are documented in the Stratix V device datasheet.

Typical Applications

• Custom digital systems — Implement application-specific logic, state machines, and control functions in commercial electronic products.
• Prototyping and development — Board-level prototyping where high logic capacity and abundant I/O simplify system validation and iteration.
• High-density I/O integration — Designs requiring many external interfaces or parallel buses benefit from the 600 I/O pins and dense package.

Unique Advantages

• High logic capacity: 420,000 logic elements reduce the need to split designs across multiple devices.
• Significant on-chip memory: Approximately 38 Mbits of embedded RAM supports large buffers and stateful logic without external memory.
• Extensive external interfacing: 600 I/O pins enable complex multi-channel and parallel interfaces.
• Compact FCBGA package: 1517-BBGA (supplier 1517-FBGA 40×40) offers a compact footprint for high-density board designs.
• Low-voltage core operation: 820 mV–880 mV supply range aligns with modern low-voltage architectures.
• Commercial temperature performance and compliance: Rated 0 °C–85 °C and RoHS compliant for commercial product deployments.

Why Choose 5SGXMA4K3F40C3N?

The 5SGXMA4K3F40C3N delivers a combination of high logic density, substantial embedded memory, and a large I/O count in a compact FCBGA package, making it suitable for demanding commercial FPGA designs. As a member of the Intel Stratix V GX family, the device is supported by series-level documentation covering electrical characteristics and I/O timing.

This device is well suited for engineering teams and procurement looking for a commercially rated FPGA offering extensive on-chip resources, a low-voltage core, and a surface-mount FCBGA package for board-level integration.

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