5SGXMA4K3F40C4N

The 5SGXMA4K3F40C4N is a Stratix V GX field programmable gate array (FPGA) IC from Intel. It provides high-density programmable logic, a large amount of embedded RAM, and an extensive I/O complement in a 1517-ball BGA (FCBGA) package for commercial applications.

Designed for designs requiring substantial on-chip logic capacity and I/O integration, the device combines 420,000 logic elements with approximately 38 Mbits of embedded memory and 600 I/O pins, while operating from a core voltage range of 820 mV to 880 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core density — 420,000 logic elements (cells) and 158,500 LABs provide substantial programmable logic resources for complex designs.
• Embedded memory — Approximately 38 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
• I/O capability — 600 dedicated I/O pins to support high pin-count interfaces and board-level connectivity.
• Power and voltage — Core supply range of 820 mV to 880 mV to match platform power budgeting and regulation requirements.
• Package and mounting — 1517-BBGA, FCBGA (supplier package: 1517-FBGA 40×40) in a surface-mount form factor for compact system integration.
• Temperature and grade — Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Standards compliance — RoHS‑compliant construction.
• Family-level documentation — Stratix V device documentation includes electrical, switching, and I/O timing characteristics; the GX family documentation lists transceiver speed-grade information for reference.

Typical Applications

• High-density logic designs — Use the device where large programmable logic capacity is required for complex algorithm implementation or hardware acceleration.
• I/O‑intensive systems — Suitable for designs that need many external interfaces or signal aggregations, leveraging the 600 I/O pins.
• Memory‑dependent architectures — On-chip embedded memory supports buffering, packet storage, and intermediate data staging for real-time processing.
• Platform prototyping and integration — Surface-mount 1517-BBGA package enables compact board-level integration during platform development.

Unique Advantages

• Large on-chip logic capacity: 420,000 logic elements reduce the need for multi-device partitioning in many designs.
• Substantial embedded RAM: Approximately 38 Mbits of RAM enables on-chip data handling and reduces external memory bandwidth demands.
• High I/O count: 600 I/Os simplify integration of multiple interfaces and peripherals without complex multiplexing.
• Commercial-grade operation: Specified for 0 °C to 85 °C to match typical commercial deployments.
• Compact package: 1517-ball FCBGA (40×40) surface-mount package supports dense PCB layouts and compact system form factors.
• RoHS compliant: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose 5SGXMA4K3F40C4N?

The 5SGXMA4K3F40C4N positions itself as a high-density, I/O-rich Stratix V GX FPGA option for commercial applications that require extensive programmable logic and substantial on-chip memory. With 420,000 logic elements, approximately 38 Mbits of embedded RAM, and 600 I/Os in a 1517-BBGA package, it addresses designs that need tight integration of logic, memory, and external interfaces while remaining within a commercial temperature envelope.

Backed by Stratix V family documentation from Intel/Altera, the device benefits from detailed electrical and switching characteristic references to guide power, timing, and I/O implementation in production designs.

Request a quote or submit an inquiry today to obtain pricing and availability for the 5SGXMA4K3F40C4N and evaluate it for your next high-density FPGA design.