5SGXMA4K3F40I3LG

The 5SGXMA4K3F40I3LG is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel. This industrial-grade, surface-mount FCBGA device integrates a high logic capacity, substantial on-chip RAM, and a large I/O count in a 1517-BBGA (1517-FBGA, 40×40) package.

Designed for demanding embedded and industrial systems, the device targets applications that require high logic density, significant embedded memory, and broad I/O connectivity while operating over an extended temperature range.

Key Features

• Logic Capacity  420,000 logic elements (cells) provide extensive programmable logic for complex designs.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM supports large data buffering, LUTs, and state storage.
• I/O Resources  600 general-purpose I/O pins enable wide connectivity to peripherals, buses, and external devices.
• Package and Mounting  1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40×40) with surface-mount assembly for compact, board-level integration.
• Power  Core voltage supply range of 820 mV to 880 mV for the device core domain.
• Temperature Grade  Industrial operating temperature range from −40 °C to 100 °C for use in harsh environments.
• Compliance  RoHS-compliant manufacturing.
• Stratix V GX Family Attributes  Part of the Stratix V GX series, which includes devices with integrated transceiver capabilities for high-speed serial links (see Stratix V device documentation for details).

Typical Applications

• High-performance data processing  Large logic capacity and substantial embedded RAM make the device suitable for compute-intensive FPGA-based accelerators and signal processing tasks.
• Networking and communications  Part of the Stratix V GX family with transceiver capabilities, providing a platform for complex packet processing, switch fabric, and protocol bridging implementations.
• Industrial control and automation  Industrial temperature rating and extensive I/O enable robust control systems, real-time monitoring, and distributed I/O applications.
• Prototyping and system integration  High-density logic and broad I/O simplify consolidation of multiple functions into a single FPGA for rapid prototyping and system-level integration.

Unique Advantages

• High logic density: 420,000 logic elements allow integration of complex state machines, datapaths, and custom processors on a single device.
• Significant on-chip memory: Approximately 38 Mbits of embedded RAM reduces reliance on external memory for buffering and accelerates data paths.
• Extensive I/O capability: 600 I/Os enable direct interfacing to a wide range of peripherals and parallel data buses, simplifying board-level routing.
• Industrial-grade operation: Rated for −40 °C to 100 °C to meet temperature demands of industrial deployments.
• Compact FCBGA packaging: 1517-BBGA (1517-FBGA, 40×40) package provides high pin density in a compact footprint for space-constrained designs.
• Standards-compliant manufacturing: RoHS compliance supports environmental and regulatory requirements.

Why Choose 5SGXMA4K3F40I3LG?

The 5SGXMA4K3F40I3LG delivers a combination of high logic capacity, ample embedded memory, and a large I/O complement in an industrial-grade Stratix V GX FPGA. Its FCBGA package and surface-mount form factor make it suitable for densely integrated boards where performance and connectivity are priorities.

As a member of the Stratix V GX family and an Intel-manufactured device, it is documented within the Stratix V device literature, providing designers with the device-level electrical and timing data needed to evaluate system integration, power, and thermal considerations.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGXMA4K3F40I3LG for your next high-density FPGA design.